DS21352, DS21552
3.3V DS21352及5V DS21552 T1单芯片收发器
数据资料
完整的数据资料
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概述
The DS21352/552 T1 single chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX-1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can generate both DSX-1 line build outs as well as CSU line build-outs of -7.5dB, -15dB, and -22.5dB. The onboard jitter attenuator (selectable to either 32 bits or 128 bits) can be placed in either the transmit or receive data paths. The framer locates the frame and multiframe boundaries and monitors the data stream for alarms. It is also used for extracting and inserting robbed-bit signaling data and FDL data. The device contains a set of internal registers which the user can access and control the operation of the unit. Quick access via the parallel control port allows a single controller to handle many T1 lines. The device fully meets all of the latest T1 specifications including ANSI T1.403-1995, ANSI T1.231-1993, AT&T TR 62411 (12-90), AT&T TR54016, and ITU G.703, G.704, G.706, G.823, and I.431.
关键特性
Complete DS1/ISDN-PRI/J1 transceiver functionality
Long and Short haul LIU
Crystal-less jitter attenuator
Generates DSX-1 and CSU line build-outs
HDLC controller with 64-byte buffers Configurable for FDL or DS0 operation
Dual two-frame elastic store slip buffers that can connect to asynchronous backplanes up to 8.192MHz
8.192MHz clock output locked to RCLK
Interleaving PCM Bus Operation
Per-channel loopback and idle code insertion
8-bit parallel control port muxed or nonmuxed buses (Intel or Motorola)
Programmable output clocks for Fractional T1
Fully independent transmit and receive functionality
Generates/detects in-band loop codes from 1 to 8 bits in length including CSU loop codes
IEEE 1149.1 JTAG-Boundary Scan
Pin compatible with DS2152/54/354/554 SCTs
100-pin LQFP package (14 mm x 14 mm) 3.3V (DS21352) or 5V (DS21552) supply; low power CMOS
Notes:
** This pricing is BUDGETARY, for comparing similar parts. Prices are in
U.S. dollars and subject to change. Quantity pricing may vary
substantially and international prices may differ due to local
duties, taxes, fees, and exchange rates. For volume-specific prices
and delivery, please see the price and availability page
or contact an authorized distributor.
应用笔记
App Note 307: DS2152, DS2154, DS2151, DS2153, DS21X5Y and DS2155 Three Channel Drop and Insert - DS21352, DS21552 (English only)App Note 309: Interfacing to the Fractional T1 and E1 - DS21352, DS21552 (English only)App Note 310: D4 Framing and Signaling - DS21352, DS21552 (English only)App Note 319: DS2152, DS2154, DS21x5Y, and DS2155 Interfacing to the MC68360 (QUICC32) - DS21352, DS21552 (English only)App Note 324: T1/E1 Network Interface Design - DS21352, DS21552 (English only)App Note 325: DS2151, DS2152, DS2153, DS2154 Dallas Single Chip Transceiver Crystal Selection Guide - DS21352, DS21552 (English only)App Note 336: Transparent Operation on T1, E1 Framers and Transceivers - DS21352, DS21552 (English only)App Note 337: DS2151 Implementation of ANSI T1.231-1993 - DS21352, DS21552 (English only)App Note 342: T1/E1 Framer Initialization and Programming - DS21352, DS21552 (English only)App Note 345: DS21352/552, DS2151, DS2152, DS2141A, DS21Q42 Programming SLC-96 - DS21352, DS21552 (English only)App Note 351: T1/E1 and T3/E3 Transformer Selection Guide - DS21352, DS21552 (English only)App Note 355: DS21Q4x, DS215x, and DS21x5y Test Registers - DS21352, DS21552 (English only)App Note 360: DS21352/DS21552 versus DS2152 Single Chip Transceiver - DS21352, DS21552 (English only)App Note 370: Using RCLK in a BITS/SSU Application - DS21352, DS21552 (English only)App Note 374: DS2155 vs. DS21x5y: Software and Hardware Considerations
- DS21552 (English only)App Note 379: Conversion Between T1 and E1
- DS21352, DS21552 (English only)App Note 381: Interfacing the DS2155 to the MPC8260 - DS21352 (English only)App Note 382: J1 Japanese Standards - DS21352, DS21552 (English only)App Note 388: Hitless Protection Switching with 1+1 Redundancy - DS21352, DS21552 (English only)App Note 391: NRZ Applications - DS21352, DS21552 (English only)App Note 394: HDLC Configuration of Framers and Transceivers - DS21352, DS21552 (English only)App Note 405: Power-Fault Protection Layout - DS21352, DS21552 (English only)App Note 461: Programming and Controlling the FDL on DS2141A, DS2151 - DS21352, DS21552 (English only)App Note 2713: Switching Frame Mode In Live T1 Systems
- DS21352, DS21552 (English only)应用笔记3121:选择T1/E1/J1单片收发器 - DS21352, DS21552App Note 3208: Elastic Store Operation - DS21352, DS21552 (English only)应用笔记3349:Dallas Semiconductor T1/E1/J1收发器的环回操作 - DS21352, DS21552应用笔记3547:T3/E3/STS-1 LIU的回波损耗测量 - DS21352, DS21552App Note 3760: Interleaved Bus Operation - DS21352, DS21552 (English only)
定购信息
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型号尾缀:T或T&R = 卷带; + = RoHS/无铅; # = RoHS/无铅豁免权。详细信息请参考:完整的数据资料 或型号命名规则 。
* “封装代码/变更”提供产品使用的变更信息。注意:型号尾缀中的“+”、“#”和“-”表示器件的RoHS状况,封装图上可能显示不同的尾缀字符。
器件:
1-13
of
13
DS21352
免费样品
采购
封装:
类型 引脚 占位面积
封装图编码/变更 *
温度
RoHS/无铅? 材料分析
DS21352G
CSBGA;100引脚;100mm²
封装图: 21-0357 (PDF)
Land Pattern: Not Available
使用封装码/变更:X100-3*
0°C至+70°C
RoHS/无铅:否
材料分析
DS21352GN
CSBGA;100引脚;100mm²
封装图: 21-0357 (PDF)
Land Pattern: Not Available
使用封装码/变更:X100-3*
-40°C至+85°C
RoHS/无铅:否
材料分析
DS21352LN+
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L+3*
0°C至+70°C
RoHS/无铅:无铅
材料分析
DS21352L
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L-3*
0°C至+70°C
RoHS/无铅:否
材料分析
DS21352LB
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L-3*
0°C至+70°C
RoHS/无铅:否
材料分析
DS21352L+
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L+3*
0°C至+70°C
RoHS/无铅:无铅
材料分析
DS21352L-C02
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L-3*
0°C至+70°C
RoHS/无铅:否
材料分析
DS21352LB+
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L+3*
0°C至+70°C
RoHS/无铅:无铅
材料分析
DS21352LN
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L-3*
-40°C至+85°C
RoHS/无铅:否
材料分析
DS21552
免费样品
采购
封装:
类型 引脚 占位面积
封装图编码/变更 *
温度
RoHS/无铅? 材料分析
DS21552L
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L-3*
0°C至+70°C
RoHS/无铅:否
材料分析
DS21552L+
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L+3*
0°C至+70°C
RoHS/无铅:无铅
材料分析
DS21552LN+
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L+3*
-40°C至+85°C
RoHS/无铅:无铅
材料分析
DS21552LN
LQFP;100引脚;262mm²
封装图: 21-0297 (PDF)
Land Pattern: Not Available
使用封装码/变更:C100L-3*
-40°C至+85°C
RoHS/无铅:否
材料分析
2000-12-07
本页最后一次更新: 2007-06-21