 |
|
|
Maxim >
质量担保与可靠性 >
可靠性报告
> 监督报告 |
|
可靠性监控流程(Q1 1996) |
|
- Reliability Monitor Program (RMP) Description
An Overview of the RMP and a detailed Description of the Data Summaries and Stress Tests used in the RMP. References in ( ) below refer to tables and attachments in the hard copy report.
- RMP Sampling Plan
A table (table 1) of products, packages, and assembly sites included in the Monitors. Frequency and sample sizes are also included.
- RMP Stress Tests
Test Plan for Modules, IC's, SipStik's, and Touch Memory (tables 2, 3, 4, and 5).
- Reliability Data (Attachment A)
Single lot summaries from the Sampling Plan. Data included provides details for read points, sample sizes, and failures, as well as, a calculated failure rate/percent defective by stress.
- Reliability Summary Data (Attachment B)
An historical listing of data generated by the RMP for the past year. Data is sorted by technology type for Operating Life and by Assembly Site and Package for remaining stresses.
- Reliability Summary Data (Attachment B - Graphical)
Reliability Performance graphs of Operating Life and Infant Life for the past year.
- Corrective Action Summary (Attachment C)
Outstanding failures from the RMP tracked by reliability job number, failure analysis job number, failure mechanism, and corrective action. As failures are resolved through corrective action, they are removed from this summary.
|
|
|
|
|
