| 材料类型 |
说明 |
供应商 |
材料 |
MSDS文件名 |
| 电池 |
电池 |
Panasonic |
Lithium ML |
MSDS_BATTERY_PANASONIC_LITHIUMML_10-01-2004.pdf |
| 电池 |
电池 |
Panasonic |
Lithium CR |
MSDS_BATTERY_PANASONIC_LITHIUMCR_12-29-2004.pdf |
| 电池 |
电池 |
Panasonic |
Lithium BR |
MSDS_BATTERY_PANASONIC_LITHIUMBR_10-01-2004.pdf |
| 绑定线 |
绑定/焊球引线 |
Tanaka (Carsem及其他) |
Au Type 4N |
MSDS_TANAKA_AuWIRE-4N_10-28-2005.pdf |
| 绑定线 |
绑定/焊球引线 |
Heraeus (Amkor及其他) |
Au Wire Type GPG-2 |
MSDS_AMKOR-TANAKA_AuWIRE-GPG2_04-03-2006.pdf |
| 绑定线 |
绑定/焊球引线 |
MKE (Amkor及其他) |
Au Wire Type 2N |
MSDS_AMKOR-MKE_AuWIRE-2N_11-17-2006.pdf |
| 绑定线 |
绑定/焊球引线 |
Heraeus (Amkor及其他) |
Au Wire Type HA3 |
MSDS_AMKOR-HERAEUS_AuWIRE-HA3_11-16-2007.pdf |
| 绑定线 |
绑定/焊球引线 |
Tanaka (Hereaus及其他) |
Au Wire Type GPG |
MSDS_SC-TANAKA_AuWIRE-GPG_03-26-2004.pdf |
| 绑定线 |
绑定/焊球引线 |
Hereaus (Cirtek及其他) |
Au wire types HD2, HD5, HD6, HA6 |
MSDS_CIRTEK-HEREAUS_AuWIRE-4TYPES_01-16-2007.pdf |
| 绑定线 |
绑定/焊球引线 |
Heraeus (ISPL) |
Au Wire Type HD5 |
MSDS_ISPL-HEREAUS_Au-BOND-WIRE-HD5_11-16-2007.pdf |
| 绑定线 |
绑定/焊球引线 |
Hana-Tanaka |
Au wire 4N type |
MSDS_HANA-TANAKA_GOLD-_WIRE-4N_04-01-2005_R09-28-2007.pdf |
| 绑定线 |
绑定/焊球引线 |
MK Electron |
Au Wire L |
MSDS_MK-ELECTRON_GOLD-WIRE-L_09-16-2004_R09-28-2007.pdf |
| 绑定线 |
绑定/焊球引线 |
MK Electron |
Au Wire Types M, T, UB, R |
MSDS_MK-ELECTRON_GOLD-WIRE_TYPES_M_T_UB_R_12-20-2000_R01-08-2008.pdf |
| 绑定线 |
绑定/焊球引线 |
OSEP-Heraeus |
Au wire types HD5CE/HD6CA/HD2BE |
MSDS_HEREAUS_Au-WIRE_TYPES-HD2B3-HD5CE-HD6CA_R02-07-2008.pdf |
| 绑定线 |
绑定/焊球引线 |
Sumitomo (SPIL) |
Au Wire |
MSDS_SPIL-SUMITOMO_Au-WIRE_NODATE.pdf |
| 涂料 |
BCB |
Dow |
Cyclotene 4024 40 Resin |
MSDS_DOW_CYCLOTENE-4024-40-RESIN_04-12-2006.pdf |
| 芯片粘接 |
芯片粘接 |
Hitachi |
EN4900-F-1 |
MSDS_HITACHI_EN4900-F-1_08-01-2001.pdf |
| 芯片粘接 |
芯片粘接 |
Ablebond |
2300 |
MSDS_ABLEBOND_2300_05-08-2001.pdf |
| 芯片粘接 |
芯片粘接 |
Ablebond |
2000 |
MSDS_ABLEBOND_2000_09-27-2005.pdf |
| 芯片粘接 |
芯片粘接 |
ABLESTIK |
ABLETHERM 8600 |
MSDS_ABLETHERM_8600_06-08-2004_R02-19-2008.pdf |
| 芯片粘接 |
芯片粘接 |
ABLESTIK |
Ablebond 2025 |
MSDS_ABLEBOND_2025_08-27-2000.pdf |
| 芯片粘接 |
芯片粘接 |
ABLESTIK |
Ablebond 8390A |
MSDS_ABLEBOND_8390A_05-07-1999.pdf |
| 芯片粘接 |
芯片粘接 |
OSEP-Hitachi |
EN-4900G |
MSDS_OSEP-HITACHI_EN-4900G_08-05-2005_R02-07-2008.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8006 |
MSDS_ABLEBOND_8006_10-18-2002_R11-20-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
2600BT |
MSDS_ABLEBOND_2600BT_03-25-2004_R11-20-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
2033SC |
MSDS_ABLEBOND_2033SC_05-08-2002_R11-20-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8200 |
MSDS_ABLEBOND_8200_09-27-2005_R11-20-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8200C |
MSDS_DIE_ATTACH_ABLEBOND_8200C_10-11-2004_R11-20-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
84-1LMISNB |
MSDS_ABLEBOND_84-1LMISNB_06-19-2006.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
84-1LMISR4 |
MSDS_ABLEBOND_84-1LMISR4_11-10-2006.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
84-3J |
MSDS_ABLEBOND_84-3J_09-10-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
2025D |
MSDS_ABLEBOND_2025D_04-24-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
2200 |
MSDS_ABLEBOND_2200_09-01-2000_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
2200D |
MSDS_ABLEBOND_2200D_03-20-2001_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
3230 |
MSDS_ABLEBOND_3230_09-27-2005_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8006NS |
MSDS_ABLEBOND_8006NS_06-28-2004_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8200T |
MSDS_ABLEBOND_8200T_02-06-2004_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8290 |
MSDS_ABLEBOND_8290_07-23-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8361J |
MSDS_ABLEBOND_8361J_12-19-2005_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Ablestik-Ablebond |
8600 |
MSDS_ABLEBOND_8600_06-08-2004_R09-19-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Loctite |
QMI-536 |
MSDS_LOCTITE_QMI536_08-02-2005_R09-17-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Loctite |
QMI-519 |
MSDS_LOCTITE_QMI519_09-12-2005_R09-17-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Loctite |
QMI-529LB |
MSDS_LOCTITE_QMI529LB_12-15-2003_R09-17-2007.pdf |
| 芯片粘接 |
芯片粘接料 |
Sumitomo |
CRM-1076E |
MSDS_LOCTITE-HYSOL_CNB925-42_05-28-2003.pdf |
| 密封剂 |
液体密封剂 |
Loctite-Hysol |
CNB924-42 |
MSDS_SUMITOMO_CRM-1076E_11-29-2001_R09-17-2007.pdf |
| 密封剂 |
液体密封剂 |
Loctite-Hysol |
FP4451 |
MSDS_LOCTITE-HYSOL_FP4451_12-15-2000.pdf |
| 薄膜 |
倒装芯片背面压膜 |
Lintec Corp |
Adwill LC2850(40) |
MSDS_ADWILL_LC2850-40_09-27-2004.pdf |
| 助焊剂 |
助焊剂 |
Kester (Cirtek) |
2164-A |
MSDS_KESTER-FLUX-2164-A_02-07-2003.pdf |
| 油墨 |
用于印刷的油墨 |
Applied Innotech (OSE) |
M238 |
MSDS_INK_OSE-APPLIED-INNOTECH_M238_11-01-2007_R02-22-2008.pdf |
| 油墨 |
油墨 |
TecaPrint |
TC118 |
MSDS_INK_TECAPRINT_TPC118_06-04-2007_R11-19-2007.pdf |
| 油墨 |
油墨 |
TecaPrint |
TCP508 |
MSDS_INK_TECAPRINT_TPC508_09-08-2004_R11-19-2007.pdf |
| 油墨 |
油墨 |
TecaPrint |
TCP528 |
MSDS_INK_TECAPRINT_TPC528_09-08-2004_R11-19-2007.pdf |
| 油墨 |
油墨 - 清洁剂 |
Markem |
320 |
MSDS_INK-CLEANER_MARKEM_320_04-18-2007.pdf |
| 油墨 |
油墨 - 清洁剂 - 稀释剂 |
Markem |
501 |
MSDS_INK-CLEANER-THINNER_MARKEM_501_04-18-2007.pdf |
| 油墨 |
用于标记的墨水 |
Markem |
7281-Black |
MSDS_INK_MARKEM_7281-BLACK_12-14-2005_R11-19-2007.pdf |
| 油墨 |
用于标记的墨水 |
Markem |
7281-Silver |
MSDS_INK_MARKEM_7281-SILVER_12-14-2005_R11-19-2007.pdf |
| 油墨 |
用于标记的墨水 |
Markem |
7281-White |
MSDS_INK_MARKEM_7281-WHITE_12-14-2005_R11-19-2007.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
4488-White |
MSDS_MARKEN_4488-WHITE_11-08-2005.pdf |
| 油墨 |
用于标记的墨水 |
Markem |
7281-GREY479J |
MSDS_INK_MARKEM_7281-GREY-479-J_12-14-2005.pdf |
| 油墨 |
用于标记的墨水 |
Markem |
7224-GREY328J |
MSDS_INK_MARKEM_7224-GREY328J_03-25-2005_R11-20-2007.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
4461 Black |
MSDS_INK_MARKEM_4461-BLACK_04-18-2007.pdf |
| 油墨 |
用于标记的墨水 |
Markem |
UV400-White |
MSDS_INK_BONMARQUE_UV400-WHITE_05-09-2004_R11-2-2007.pdf |
| 油墨 |
油墨 - 强化剂 |
TecaPrint |
HM |
MSDS_INK-HARDENER_TECAPRINT_HM_04-16-2007_R11-19-2007.pdf |
| 油墨 |
油墨 - 缓凝剂 |
TecaPrint |
ZG |
MSDS_INK-RETARDER_TECAPRINT_ZG_07-11-2007_R11-19-2007.pdf |
| 油墨 |
油墨 - 缓凝剂 |
TecaPrint |
ZF |
MSDS_INK-RETARDER-CLEANER_TECAPRINT_ZF_06-23-2007_R11-19-2007.pdf |
| 油墨 |
油墨 - 稀释剂 |
Markem |
320 |
MSDS_INK-THINNER_MARKEM_320_11-23-2005_R11-19-2007.pdf |
| 油墨 |
油墨 - 稀释剂 |
TecaPrint |
VD |
MSDS_INK-THINNER_TECAPRINT_VD_07-11-2006_R11-19-2007.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
7224 Black 65-A |
MSDS_INK_MARKEM_7224-BLACK-65-A_01-23-2008.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
4466 White |
MSDS_INK_MARKEM_4466-WHITE_10-31-2007.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
4488 Black |
MSDS_INK_MARKEM_4488-BLACK_10-31-2007.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
4496 White |
MSDS_INK_MARKEM_4496-WHITE_11-08-2005.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
7224 Grey F |
MSDS_INK_MARKEM_7224-GREY-F_01-23-2008.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
7261 Black |
MSDS_INK_MARKEM_7261-BLACK_04-18-2007.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
9060 White Extra Heavy (EXH) |
MSDS_INK_MARKEM_9060-WHITE-EXH_12-14-2005.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
9060 Heavy (H) White |
MSDS_INK_MARKEM_9060-H-WHITE_12-14-2005.pdf |
| 油墨 |
用于印刷的油墨 |
Markem |
9060 White |
MSDS_INK_MARKEM_9060-WHITE_12-14-2005.pdf |
| 引线框架 |
引线框架 |
ASM (ISPL) |
Cu C194 |
MSDS_ISPL-ASM_CuC194_LEADFRAMES_03-08-2006.pdf |
| 引线框架 |
引线框架 |
ASM (ISPL) |
Cu Alloy 194, Spot Ag Plate |
MSDS_ISPL-ASM_A194-AgPLATE_12-29-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-ASM |
A194 NiPdAu, C7025 NiPdAu, A194 Ag, A151 Ag |
MSDS-UTL-NSEB-ASM_FOR-PKG-CODE_Z32+1_Z32+2_04-20-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-SUMIKO |
A194 Ag |
MSDS_ULT-NSEB-SUMIKO_FOR-PKG-CODE_S8+2_S8+4_S8+5_S14+1_P8+2_P8+6_07-27-2006.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-ASM |
A151 Ag, A194 NiPdAu, C7025 NiPdAu, A194 Ag, C7025 Ag |
MSDS-UTL-NSEB-ASM_FOR-PKG-CODE_U20+1_01-22-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-DAI-NIPPON |
EFTEC-64T |
MSDS-UTL-NSEB-DAI-NIPPON_FOR-PKG-CODE_T1033+1_T1433+1_T1644+2_R09-17-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-DAI-NIPPON |
C194 |
MSDS-UTL-NSEB-DAI-NIPPON_FOR-PKG-CODE_T1633+1_R09-27-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-JADE |
C194 Ag, C7025 Ag, C194 NiPdAu, C7025 NiPdAu, C194 Ag/A2, C7025 Ag/A2 |
MSDS-UTL-NSEB-JADE_FOR-PKG-CODE_Z28+1_08-02-2006.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-MHT |
C914 |
MSDS_UTL-NSEB-MHT_FOR-PKG-CODE_S16+2_08-16-2006.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-OHKUCHI |
C194 PPF |
MSDS-UTL-NSEB-OHKUCHI_FOR-PKG-CODE_T1435+1_02-08-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-OHKUCHI |
C194 Ag, C7025 Ag, C194 NiPdAu, C7025 NiPdAu, C194 Ag/A2, C7025 Ag/A2 |
MSDS-UTL-NSEB-OHKUCHI_FOR-PKG-CODE_T2444+1_T633+1_T633+2_09-28-2005_R09-27-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-POSSEHL |
C7025 Ag |
MSDS-UTL-NSEB-OHKUCHI_FOR-PKG-CODE_T2444+1_T633+1_T633+2_09-28-2005_R09-27-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-POSSEHL |
C7025 Ag |
MSDS-UTL-NSEB-POSSEHL_FOR-PKG-CODE_U14+1_U16+1_U24+1_U28+2_U28E+1_U10+2_U28+3_U8+1_07-04-2005_R09-27-2007.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-POSSEHL |
A194 Ag |
MSDS-UTL-NSEB-POSSEHL_FOR-PKG-CODE_U3+2_U5+1_S16+1_06-22-2006.pdf |
| 引线框架 |
引线框架 |
ASM |
Cu A151 Spot Ag Plated, Cu A194 NiPdAu plated, Cu C7025 NiPdAu plated, Cu A194 Spot Ag plated, Cu C7025 Ag plated |
MSDS_ASM_LEADFRAME_A151_A194_C7025_SPOT-Ag_NiPdAu_01-22-2007.pdf |
| 引线框架 |
引线框架 |
DIA-NIPPON |
EFTEC-64T (C18045) |
MSDS_DAI-NIPPON_EFTEC-64T_09-29-2004_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
JADE |
Cu C194 & C7025 Spot Plated Ag, Cu C194 & C7025 NiPdAu Plated, Ferrous Based Spot Ag Plated, C914 & C7025 Spot Ag and Full A2 Plate |
MSDS_JADE_LEADFRAME_C194_C7025_SPOT-Ag_OR_NiPdAu_08-02-2006_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
MITSU |
Cu C194 Spot Ag Plated |
MSDS_MITSU_LEADFRAME_C194_SPOT-Ag_08-14-2006_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Possehl |
Cu A194 |
MSDS_POSSEHL_LEADFRAME_ALLOY_A194_06-22-2005_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Possehl |
Cu Alloy A194 Spot Plated Ag |
MSDS_POSSEHL_LEADFRAME_ALLOY-A194-SPOT-Ag_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Possehl |
Cu Alloy C7025 Spot Plated Ag |
MSDS_POSSEHL_LEADFRAME_ALLOY-C7025-SPOT-Ag_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Possehl |
Cu C7025 Spot Plated Ag |
MSDS_POSSEHL_LEADFRAME_C7025_SPOT-Ag_06-16-2005_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Samsung |
Cu C194 Spot Ag Plated |
MSDS_SAMSUNG_LEADFRAME_C194-SPOT-Ag_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Sumitomo |
Cu C194 QFN Spot Ag Plated |
MSDS_SUMITOMO_LEADFRAME-QFN_C194_SPOT-Ag_09-28-2005_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
Suniko |
Cu C194 Spot Ag Plated |
MSDS_SUNIKO_A194_SPOT-Ag_07-27-2006_R01-08-2008.pdf |
| 引线框架 |
引线框架 |
UTL-NSEB-SAMSUNG-TECHWIN |
C194 Ag |
MSDS-UTL-NSEB-SAMSUNG-TECHWIN_FOR-PKG-CODE_W8+3_W8+2_R09-27-2007.pdf |
| 引线框架 |
引线框架 |
OSEP-Poongsan |
Cu C194 for TSOC package types |
MSDS_OSEP-POONGSAN_LEADFRAMES_CuC914-TSOC-TYPES_R02-07-2008.pdf |
| 引线框架 |
引线框架 |
OSEP-Samsung |
Spot Ag Cu C194 Types |
MSDS_OSE-SAMSUNG_SPOT-Ag_CuC194_R02-07-2008.pdf |
| 引线框架 |
引线框架 |
OSEP-Dynacraft |
Spot Ag Cu C7025 Types |
MSDS_OSEP-DYNACRAFT_SPOT-Ag-CuC7025-TYPES_01-25-2007.pdf |
| 引线框架 |
引线框架 |
Amkor-Poongsan |
Cu C194R types |
MSDS_AMKOR-POONGSAN_C194R_LEADFRAME_04-17-2006_R02-18-2008.pdf |
| 引线框架 |
引线框架 |
Mitsu Hi Tech (Hana及其他) |
Cu C194 |
MSDS_MITSU_CuC194_05-09-2006.pdf |
| 引线框架 |
引线框架 |
ASM (Hana及其他) |
Cu A194 |
MSDS_ASM_CuA194_04-20-2006.pdf |
| 引线框架 |
引线框架 |
QPL (Hana及其他) |
Cu CDA194 with Ag plate |
MSDS_QPL_CDA194-AgPLATE-LEADFRAME_02-07-2006.pdf |
| 引线框架 |
引线框架 |
Possehl (ISPL及其他) |
Cu A194 with Ag plate |
MSDS_ISPL-POSSEHL_CuA194-AgPLATE_10-31-2006.pdf |
| 引线框架 |
引线框架 |
Dynacraft (Carsem及其他) |
Alloy 42 with Spot Ag plate |
MSDS_CARSEM-DYNACRAFT_ALLOY42-AgSPOT_09-12-2006.pdf |
| 引线框架 |
引线框架 |
Dynacraft (Carsem及其他) |
CuC194 with Spot Ag plate |
MSDS_CARSEM-DYNACRAFT_CuC194-AgSPOT_08-30-2006.pdf |
| 引线框架 |
引线框架 |
Dynacraft (Carsem及其他) |
CuC7025 with Spot Ag plate |
MSDS_CARSEM-DYNACRAFT_CuC7025-AgSPOT_05-23-2006.pdf |
| 引线框架 |
引线框架 |
Samsung-Techwin (OSE) |
Spot Ag Cu C194 |
MSDS_SAMSUNG-TECHWIN_SPOTAg-C194_04-25-2005.pdf |
| 引线框架 |
引线框架 |
Poongsan (OSE) |
Cu C194, CDA194 |
MSDS_OSE-POONGSAN_C194(CDA194)_NODATE.pdf |
| 引线框架 |
引线框架 |
Poongsan (OSE) |
CDA19210 |
MSDS_OSE-POONGSAN_CDA19210_NODATE.pdf |
| 模塑材料 |
模塑材料 |
Nitto-Denko |
MP-8000CSM |
MSDS_NITTO-DENKO_MP-8000CSM_05-27-2004.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-6300HR |
MSDS_SUMITOMO_EME-6300HR_09-25-2002.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-7351LS |
MSDS_SUMITOMO-EME-7351LS_12-15-2006.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-6300H |
MSDS_SUMITOMO_EME-6300H_04-24-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-6600CS |
MSDS_SUMITOMO_EME-6600CS_08-28-2002_R01-25-2008.pdf |
| 模塑材料 |
模塑材料 |
Nitto Denko |
MP-8000CH4 |
MSDS_NITTO-DENKO_MP8000CH4_10-18-2005_R01-08-2008.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-6600CS |
MSDS_SUMITOMO-EMEG6600CS_08-28-2002_R01-08-2008.pdf |
| 模塑材料 |
模塑材料 |
Hitachi |
CEL-9200 SERIES |
MSDS_HITACHI_CEL9200-SERIES_02-19-1997_R10-31-2007.pdf |
| 模塑材料 |
模塑材料 |
Hitachi |
CEL-9220HF13, CEL-X-9220HF13 |
MSDS_HITACHI_CEL9220HF13-CEL922HF13_08-019-2005_R09-28-2007.pdf |
| 模塑材料 |
模塑材料 |
Nitto Denko |
GE-100LFC |
MSDS_NITTO-DENKO_GE-100LFC_09-28-2004_R11-30-2007.pdf |
| 模塑材料 |
模塑材料 |
Nitto Denko |
MP-8000AN |
MSDS_NITTO-DENKO_MP8000AN_11-18-2003_R02-15-2008.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-6710SJ |
MSDS_SUMITOMO_EME6710SJ_09-03-2002_R09-28-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-G605 |
MSDS_SUMITOMO_EMEG605_06-09-2003_R09-28-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
EME-G770HCD |
MSDS_SUMITOMO_EME-G770HCD_05-08-2007.pdf |
| 模塑材料 |
模塑材料 |
Shinetsu |
KMC 184-7 |
MSDS_SHINETSU_KMC1847_R09-28-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
G600 |
MSDS_SUMITOMO_EMEG600_09-24-2002_R09-25-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
G700K |
MSDS_SUMITOMO_EMEG700K_05-16-2003_R09-25-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
G700 |
MSDS_SUMITOMO_EMEG700_08-21-2000_R09-25-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
G700L |
MSDS_SUMITOMO_EMEG700L_10-29-2002_R09-25-2007.pdf |
| 模塑材料 |
模塑材料 |
Sumitomo |
G700M |
MSDS_SUMITOMO_EMEG700M_09-03-2002_R09-25-2007.pdf |
| 模塑材料 |
模塑材料 |
SHINESTU |
KMC-3580P-8 |
MSDS_SHINESTU_KMC-3580P-8_06-10-2001_R02-19-2008.pdf |
| 模塑材料 |
模塑材料 |
SUMITOMO |
EME-6710S |
MSDS_SUMITOMO_EME-6710S_08-08-2006_R02-19-2008.pdf |
| 模塑材料 |
模塑材料 |
SUMITOMO |
EME-6600CR |
MSDS_SUMITOMO_EME-6600CR_08-08-2005_R02-19-2008.pdf |
| 模塑材料 |
模塑材料 |
Shinetsu |
KMC-184-7UF |
MSDS_SHINETSU_KMC1847UF_11-17-2000.pdf |
| 模塑材料 |
模塑材料 |
Nitto |
MP-8000C |
MSDS_NITTO_MP-8000C_11-22-2002.pdf |
| 模塑材料 |
模塑材料 |
SUMITOMO |
EME-7730L |
MSDS_SUMITOMO_EME-7730L_09-05-2002.pdf |
| 模塑材料 |
模塑材料 |
SUMITOMO |
EME-G770 |
MSDS_SUMITOMO_EME-G770_06-26-2006.pdf |
| 包装 |
载带 |
3M |
2703/2705/3577 |
MSDS_3M_2703-2705-3577_04-22-1999.pdf |
| 包装 |
标签纸 |
Brady Worldwide |
B-423 |
MSDS_BRADY_B423_04-29-2004.pdf |
| 包装 |
标签纸 |
Brady Worldwide |
B-477/B-478 |
MSDS_BRADY_B477-B478_05-08-2004.pdf |
| 包装 |
聚氨酯泡沫(用于纸箱内部) |
CCI |
Unifoam S82R-1 Polyurethane Foam |
MSDS_UNIFOAM-S82R1_05-27-2004.pdf |
| 包装 |
上封带 |
C-PAK PTE LTD |
CP33A |
MSDS_C-PAK_CP33A_05-08-2003.pdf |
| 包装 |
塑料卷带(WLP卷带) |
C-PAK PTE LTD |
83 RA PS XXX Antistatic Polystyrene |
MSDS_C-PAK_83RAPSXXX_04-XX-2004.pdf |
| 包装 |
包装管 |
LG CHEM LTD |
PVC |
MSDS_LG-CHEM_PVC_XX-XX-XX.pdf |
| 包装 |
防静电袋 |
DOU YEE |
DY3650-650 |
MSDS_DOUYEE_DY3650-650_12-10-2003.pdf |
| 包装 |
载带 |
ePAK |
C6 |
MSDS_EPAK_C6_XX-XX-XXX.pdf |
| 包装 |
托盘(MPPD托盘) |
ePAK |
eP13 |
MSDS_EPAK_EP13_12-29-1999.pdf |
| 包装 |
聚氨酯泡沫(防静电泡沫) |
Uratex Philippines, Inc. |
Polyurethane Foam (anti-static foam) |
MSDS_URATEK_PU-FOAM_02-23-2001.pdf |
| 包装 |
防潮袋 |
DOU YEE |
DY3008-106 |
MSDS_DOUYEE_DY3008-106_XX-XX-XXXX.pdf |
| 包装 |
载带 |
RTP Company |
ESD 0300 EM Black |
MSDS_RTP_ESD-0300-EM-BLACK_05-09-2000.pdf |
| 包装 |
端塞 |
First in Colors |
Vynoflex PL-010 PVC |
MSDS_FIRST_VYNOFLEX-PL-010-PVC_XX-XX-XXXX.pdf |
| 包装 |
包装管 |
SPI Semicon |
PVC Compound |
MSDS_SPI_PVC-COMPOUND_XX-XX-XXXX.pdf |
| 包装 |
废弃物包装管 |
Kaneka Corp. |
Nippon PVC S1001/S1003/S1007/S1008 |
MSDS_KANEKA_NIPPON-PVC-S1001-S1003-S1007-S1008_03-31-1993.pdf |
| 包装 |
防静电袋 |
MINIGRIP/ZIP-PAK |
Polyethylene or Ethylene-Olefin Copolymer |
MSDS_MINIGRIP_PE-EO_04-24-1996.pdf |
| 电镀 |
电镀阳极 |
Technic (ISPL及其他) |
Pure Sn Anode (99.99%) |
MSDS_ISPL-TECHNIC_PURESnANODE_10-31-2007.pdf |
| 电镀 |
电镀阳极 |
RedRing |
Sn85%/Pb15% |
MSDS_REDRING_Sn85-Pb15-ANODE_10-29-2001.pdf |
| 电镀 |
电镀阳极 |
RedRing |
Sn 99.99% |
MSDS_REDRING_PURESn-ANODE_R03-24-2008.pdf |
| 电镀 |
电镀 |
Hana-Ultracore |
Tin Ball |
MSDS_HANA-ULTRACORE_TIN-BALL_01-02-2007.pdf |
| 电镀 |
电镀 |
Techni |
NF Tin Solder (for Sn/Pb plate) |
MSDS_TECHNI_NF-TIN-SOLDER_07-07-2005_R09-28-2007.pdf |
| 电镀 |
电镀 |
Techni |
NF LEAD (for Sn/Pb plate) |
MSDS_TECHNI_NF-LEAD-(FOR-SOLDER)_12-20-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
Techni |
NF ADDITIVE 72BC (for Sn/Pb plate) |
MSDS_TECHNI_NF-ADDITIVE-72BC-(FOR-SOLDER)_02-15-2005_R09-28-2007.pdf |
| 电镀 |
电镀 |
Techni |
NF MODIFIER B (for Sn/Pb plate) |
MSDS_TECHNI_NF-MODIFIER-B-(FOR-SOLDER)_12-13-2004_R09-27-2007.pdf |
| 电镀 |
电镀 |
Techni |
NF Acid (for Sn/Pb plate) |
MSDS_TECHNI_NF-ACID-(FOR-SOLDER)_12-08-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
Rohm |
Solderon ST-380 Anti-oxidant |
MSDS_ROHM_SOLDERON_ST380-ANTI-OXIDANT-(FOR PLATE)_02-09-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
Rohm |
Solderon ST-380 Secondary (for plate) |
MSDS_ROHM_SOLDERON-ST380-SECONDARY-(FOR-PLATE)_03-09-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
Rohm |
Solderon ST-380 Primary (for plate) |
MSDS_ROHM_SOLDERON_ST380-PRIMARY-(FOR-PLATE)_02-09-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
Rohm |
Solderon ST-380 Tin Concentrate (for plate) |
MSDS_ROHM_SOLDERON-TIN-CONCENTRATE-(FOR-PLATE)_04-16-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
Rohm |
Solderon Acid HC (for plate) |
MSDS_ROHM_SOLDERON-ACID-HC-(FOR-PLATE)_04-16-2004_R09-28-2007.pdf |
| 电镀 |
电镀 |
UTL-KOKI |
Tin Ball |
MSDS_UTL-KOKI_TIN-BALL_12-02-1999_R01-30-2008.pdf |
| 电镀 |
电镀 |
AEM (ISPL) |
100% Tin Anode |
MSDS_ISPL-AEM-PURE-Sn-ANODE_01-30-2007.pdf |
| 电镀 |
电镀 |
AEM (ISPL) |
Sn85/Pb15 Anode |
MSDS_ISPL-AEM_85Sn-15Pb-ANODE_02-10-2007.pdf |
| 电镀 |
电镀液 |
Schlotter |
Sn Concetrate FS20 |
MSDS_SCHLOETTER_Sn-CONCENTRATE-FS20_03-30-2005.pdf |
| 电镀 |
电镀液 |
Schloetter (Cirtek及其他) |
Pb Concentrate FP |
MSDS_SCHLOETTER_LEAD-CONCENTRATE-FP_10-19-2005.pdf |
| 电镀 |
电镀液 |
Schloetter (Cirtek及其他) |
Slototin 41-1 Additive |
MSDS_SCHLOETTER_SLOTOTIN-41-1-ADDITIVE_07-15-2004.pdf |
| 电镀 |
电镀液 |
Schloetter |
99.99% Sn Anode |
MSDS_SCHLOETTER_PURESn-ANODE_04-29-2005.pdf |
| 电镀 |
锡阳极 |
Schloetter (OSE) |
100% Sn Anode |
MSDS_OSE-SCHLOETTER_PURESnANODE_06-28-1994.pdf |
| 焊球 |
BGA封装焊球 |
Senju |
Sn 4.0% / Ag 0.5% / Cu 1.0% |
MSDS_Senju_Solder-Ball_Senju_Sn4.0Ag0.5Cu1.0_11-09-2000_R10-03-2007.pdf |
| 焊球 |
焊球 |
MKE |
Sn63/Pb37 Ball |
MSDS_MKE_Sn63-Pb37-BALL_07-12-2001.pdf |
| 焊球 |
焊球 |
MKE |
Sn95.5/Ag4.0/Cu0.5% |
MSDS_MKE_Sn955-Ag4-Cu5_01-03-2008.pdf |
| 焊球 |
焊球 |
MKE |
Sn98.5/Ag1.0/Cu0.5% Ball |
MSDS_MKE_Sn985-Ag1-Cu5_04-11-2007.pdf |
| 焊球 |
焊球 |
Senju (StatsChippac及其他) |
Sn/Pb "Sparkle" Balls Type 2062 |
MSDS_SC-SENJU_Sn-Pb-SPARKLEBALLSS-2062_10-18-1996.pdf |
| 焊球 |
焊球 |
Senju (SPIL) |
Sn63/Pb37 Sparkle Ball |
MSDS_SENJU_Sn63-Pb37-SPARKLE-BALL_10-18-199 |
| 焊球 |
焊球 |
Senju (StatsChippac及其他) |
Sn/Ag/Cu ECO Solder Ball Type M705 |
MSDS_SENJU_SnAgCu-ECO-SOLDER-M705_06-21-2000.pdf |
| 覆晶基板 |
覆晶基板内层板 |
Substrate Core Mitsubishi (Hana及其他) |
CCL-HL832TF |
MSDS_MITSUBISHI_CCL-HL832TF_09-02-2002.pdf |
| 覆晶基板 |
覆晶基板内层板 |
Substrate Core Mitsubishi (Hana及其他) |
CCL-HL832HS |
MSDS_MITSUBISHI_CCL-HL832HS_05-16-2006.pdf |
| 覆晶基板 |
覆晶基板内层板 |
Mitsubishi (Amkor及其他) |
CCL-HL832NX |
MSDS_MITSUBISHI_CCL-HL832NX_05-16-2006.pdf |
| 覆晶基板 |
覆晶基板内层板 |
Mitsubishi (SPIL) |
CCL-HL832EX |
MSDS_MITSUBISHI_CCL-HL832EX_04-23-2002.pdf |
