材料测试数据文件

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	Maxim > EMMI > 材料测试数据文件

	材料测试数据文件目录包装材料喷镀物ICP数据(English only) 打印用油墨的ICP数据(English only) IC引线框架材料的ICP数据(English only) 芯片粘接材料的ICP数据(English only) IC绑定线材料的ICP数据(English only) IC模塑材料的ICP数据(English only) IC表面抛光材料的ICP数据(English only) IC硅片材料的ICP数据(English only) 焊球的ICP数据(English only) 最终产品供应商关于有害物质的声明(English only) 材料测试实验室的ISO 17025证书(English only) 裸片压膜材料测试数据(English only) PCB覆晶基板材料测试数据(English only) 用于特定产品的材料测试数据(English only) 底层填充材料测试数据(English only) 涂层材料测试数据(English only) 重新分层材料测试数据(English only) 液体密封剂材料测试数据(English only) 助熔剂材料测试数据(English only) 焊膏材料测试数据(English only) 电池材料测试数据(English only) 散热器、散热片、散热装置材料测试数据(English only) 粘接材料测试数据包装材料 MOLD COMPOUND MOLD COMPOUND AMKOR EME-M8928 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND NITTO AMKOR GC7450KM-2 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 399kB) PACKING MATERIALS EPAK AMKOR JEDEC STYLE SHIPPING TRAY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) PACKING MATERIALS ITW MERITEX AMKOR SHIPPING TUBE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) PACKING TRAY EPAK (FOR MAXIM) ep13 MMPO type plastic Jedec Tray SUPPLIER DOCUMENT STATEMENT FOR NON USE/MAX CONTENT OF SUBSTANCES: Cadmium ( Cd), Lead (Pb) , Hexavalent Chromium (CrVI), Mercury ( Hg), Polybrominated Biphenyls (PBB), Polybrominated Diphenly Ether (PBDE) July 1, 2008 CANE0803358308 SGS (PDF, 469kB) PACKING TRAY EPAK (FOR MAXIM) ep8 PES type plastic Jedec Tray SUPPLIER DOCUMENT STATEMENT FOR NON USE/MAX CONTENT OF SUBSTANCES: Cadmium ( Cd), Lead (Pb) , Hexavalent Chromium (CrVI), Mercury ( Hg), Polybrominated Biphenyls (PBB), Polybrominated Diphenly Ether (PBDE) September 22, 2008 CANEC0804120301 SGS (PDF, 241kB) 包装材料清单喷镀物ICP数据(English only) SPUTTERING TARGET PROPRIETARY (FOR CASIO) Copper (Cu) (used for uCSP/WLP packages) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Perfluorooctane sulfonates (PFOS), Tributyl Tin (TBT), Triphenyl Tin (TPT)" June 10, 2008 CE/2008/59181 SGS (PDF, 491kB) SPUTTERING TARGET PROPRIETARY (FOR CASIO) Copper (Cu) for RDL and posts (used on uCSP/WLP) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" August 1, 2008 CE/2008/77146 SGS (PDF, 195kB) SPUTTERING TARGET PROPRIETARY (FOR CHIPBOND) Titanium (Ti) (used for uCSP/WLP packages) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl)" August 11, 2008 CE/2008/80465 SGS (PDF, 718kB) SPUTTERING TARGET TOSH SMD FCI COPPER (Cu) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" July 31, 2008 SH81091561 SGS (PDF, 143kB) SPUTTERING TARGET TOSH SMD FCI NICKEL VANADIUM (NiV) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" July 31, 2008 SH8109157 SGS (PDF, 147kB) SPUTTERING TARGET TOSH SMD FCI TITANIUM (Ti) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" August 1, 2008 SH8109158 SGS (PDF, 148kB) SPUTTERING TARGET Various/Proprietary (FOR/FROM CHIPBOND) Copper (Cu) (used for uCSP/WLP packages) SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) August 25, 2008 Not Applicable Not Applicable (PDF, 36kB) 打印用油墨的ICP数据(English only) INK APPLIED INNOTECH OSE AINNOTEC M238 WHITE INK SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 22kB) INK MARKEM AMKOR 4405 BLACK SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) INK MARKEM CIRTEK 4481 WHITE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) INK MARKEM SPIL 4461 TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) INK_BONMARQUE_C-SERIES-Ag_UV-WHITE_UV-BLACK_UV4-BLACK_UV-Ag_CdPb&USE-NONUSE-SUBS_03-12-2007 (PDF, 978kB) INK_MARKEM_13TYPES_SDOC-NON-USE_PFOS_04-10-2008 (PDF, 96kB) INK_MARKEM_4488-BLACK&WHITE_SDOC-NON-USE_PFOS+_02-13-2008 (PDF, 48kB) INK_MARKEM_9060-WHITE&7281-BLACK_SDOC-CONTENT_6SUBS_03-21-2008 (PDF, 40kB) INK_MARKEM_9060-WHITE-EXH_TR6SUBS_03-21-2008 (PDF, 14kB) INK_MARKEM_9060-WHITE_TR6SUBS_03-27-2008 (PDF, 44kB) IC引线框架材料的ICP数据(English only) LEADFRAME ANY AMKOR Cu C194 Cu C7025 Cu E23Z TYPE Cu C18045 or EFTECT64T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) LEADFRAME ANY CIRTEK ALLOY 42 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) LEADFRAME ANY ISPL SOT23, TDFN AND TQFN PACKAGE TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 30, 2008 Not Applicable Not Applicable (PDF, 24kB) LEADFRAME ANY UNISEM Cu A194 with SPOT Ag OR Ni/Pd/Au PLATE Cu C7025 ALLOY 42 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 145kB) LEADFRAME AQUATEK AMKOR Cu C194 Cu C7025 Cu EFTECTE64T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) LEADFRAME ASM CIRTEK Cu C194 Cu CDA194 with Ni/Pd/Au PLATE Cu A194 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) LEADFRAME DYNACRAFT CARSEM ALLOY 42 W/NiPdAu PLATING SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 88kB) LEADFRAME DYNACRAFT CARSEM ALLOY 42 Cu C7025 Cu C194 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) LEADFRAME DYNACRAFT OSE ANY LEADFRAME TYPE INCLUDING PLATING SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 26kB) LEADFRAME JADE ISPL Cu A194 SOT23 DUAL L/F Cu A194ST Cu SKF 243 A194 Cu A194FH QFN TYPES AND PACKAGE STYLES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 43kB) LEADFRAME POONGSAN CIRTEK Cu CDA194 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) LEADFRAME POONGSON OSE Cu A194 TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 23kB) LEADFRAME POSSEHL ISPL ALL LEADFRAMES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES November 17, 2008 Not Applicable Not Applicable (PDF, 60kB) LEADFRAME POSSEHL ISPL ALL LEADFRAMES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 17, 2008 Not Applicable Not Applicable (PDF, 60kB) LEADFRAME QPL ASAT C194 TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 88kB) LEADFRAME QPL ASAT C194 TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) NOT LISTED Not Applicable Not Applicable (PDF, 88kB) LEADFRAME SAMSUNG TECHWIN OSE Cu C194 TYPES Cu C7025 TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 23kB) LEADFRAMES ASM (FOR UNISEM) All leadframe types SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) June 18, 2008 Not Applicable Not Applicable (PDF, 132kB) LEADFRAMES DYNACRAFT (FOR CARSEM) Alloy 42 leadframes w/NiPdAu preplate TEST DATA FOR PPM/WT CONTENT OF Antimony (Sb), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) July 7, 2008 KA/2008/70205 SGS (PDF, 242kB) LEADFRAMES POONGSAN (FOR UNISEM) All types of leadframes SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) June 12, 2008 Not Applicable Not Applicable (PDF, 123kB) LEADFRAMES POONGSAN (FOR UNISEM) All types of leadframes SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) June 18, 2008 Not Applicable Not Applicable (PDF, 47kB) LEADFRAMES POONGSAN (FOR UNISEM) All types of leadframes SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Tetrabromobiphenol A (TBBP-A) March 21, 2008 Not Applicable Not Applicable (PDF, 234kB) LEADFRAMES POSSEHL (FOR UNISEM) Cu leadframes (all types) SUPPLIER STATEMENT OF NON CONTENT FOR SUBSTANCES: Antimony (Sb), Bromine (Br), Chlorine (Cl), Perfluorooctane sulfonates (PFOS), Tetrabromobiphenyl A (TBBP-A) March 21, 2008 Not Applicable Not Applicable (PDF, 234kB) LEADFRAMES QPL ASAT ALL TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) LEADFRAMES QPL (FOR UNISEM) Cu leadframes (all types) SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS) June 12, 2008 Not Applicable Not Applicable (PDF, 153kB) LEADFRAMES ASM (FOR AMKOR) All types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Tributyl tin oxide (TBTO), Antimony (Sb), Tetrabromobisphenol A (TBBP-A ) December 10, 2007 N/A N/A (PDF, 211kB) LEADFRAMES ASM (FOR AMKOR) All types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluoroctyl sulfonates February 29, 2008 N/A N/A (PDF, 432kB) LEADFRAMES_AMKOR-ACQUTEK_5TYPES_SDOC-NON-USE_8SUBS_03-03-2008 (PDF, 110kB) LEADFRAMES_AMKOR-LGMICRON_SDOC-NON-USE_PFOS_11-13-2007 (PDF, 325kB) LEADFRAMES_AMKOR-POONGSAN_C914R-MULTITYPES_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 22kB) Leadframes_AMKOR-POSSEHL_SPOT-Ag-A194_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 37kB) LEADFRAMES_AMKOR-QPL_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 161kB) LEADFRAMES_AMKOR-SHINKO_16PDIP_SDOC-NON-USE_PFOS_PFAS_02-12-2008 (PDF, 27kB) LEADFRAMES_AMKOR-SUMIKO_SDOC-NON-USE_PFOS+_01-31-2008 (PDF, 29kB) Leadframes_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) Leadframes_ASM_SDOC_8SUBS-NON-USE_01-10-2008 (PDF, 479kB) Leadframes_CARSEM-DYNACRAFT_16TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 1200kB) Leadframes_Dynacraft_SDOC-NON-USE_TBBPA_16-LEADFRAME-TYPES_12-10-2007 (PDF, 45kB) Leadframes_HANA-JADE_SDOC-NON-USE-8SUBS_01-16-2008 (PDF, 19kB) LEADFRAMES_ISPL-ASM_ALL-TYPES_SDOC-NON-USE_6SUBS_01-31-2007 (PDF, 244kB) LEADFRAMES_ISPL-ASM_CuA194_SDOC-NON-USE_6SUBS_01-31-2008 (PDF, 143kB) Leadframes_MITSUI_PDIP-8&14L-300MIL_SDOC-NON-USE-10SUBS_12-27-2007 (PDF, 86kB) LEADFRAMES_OSE-POONGSAN_ALL-TYPES_SDOC-NON-USE_PFOS_PFAS_03-19-2008 (PDF, 92kB) Leadframes_QPL_SDOC_7SUBS-NON-USE_01-11-2008 (PDF, 143kB) LEADFRAME_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) LEADREAMES_OSE-DYNACRAFT_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_02-12-2008 (PDF, 78kB) 芯片粘接材料的ICP数据(English only) Ablestik_SDOC-NON-USE-OF_PFOS_09-04-2007 (PDF, 83kB) Ablestik_SDOC-NON-USE_PFC-PFOS-4OTHERS_FOR-8290_8200T_84-1LMISR4_12-17-2007 (PDF, 40kB) Ablestik_SDOC-NON-USE_TBBPA_ABLEBOND_14-TYPES-DIE-ATTACH_12-03-2007 (PDF, 35kB) DIE ATTACH ABLESTIK ABLEBOND 8006NS TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) November 25, 2008 12080804 SGS (PDF, 215kB) DIE ATTACH ABLESTIK ABLEBOND 8200T "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 26, 2008 1562971 SGS (PDF, 258kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2000 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2000B SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2000T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2025 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2025D SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2028NC SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2053S SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2300 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2700B SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 3003 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 3005 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 3230 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8200C SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8200T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8290 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8300 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8340 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8360 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8361J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8387B SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8390A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 84-1LMIS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 84-1LMISR4 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 84-3J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 84-3MV SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8510AA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8806G SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8900NC SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 965-1L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND JM2500 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND MC723 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND UF8826A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND2025DSI SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 212kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 2300 ABLEBOND 8360 ABLEBOND 8510AA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) DIE ATTACH ABLESTIK AMKOR ABLEBOND 8290 ABLEBOND 8361J ABLEBOND 2300 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK AMKORABLEBOND 84-1LMISR4 ABLEBOND 8390A ABLEBOND 3230 ABLEBOND 8290 ABLEBOND JM-2500AN ABLEBOND 84-3J ABLEBOND 8361JSUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) DIE ATTACH ABLESTIK ASAT VARIOUS ABLEBOND FORMULAS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) DIE ATTACH ABLESTIK ASE ABLEBOND 2100A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 2600BT SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 8006NS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 8200C SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 8290 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 84-1LMISNB SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 84-1LMISR4 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CARSEM ABLEBOND 84-3J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK CIRTEK ABLEBOND 8900NC ABLEBOND 84-1LMISR4 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK ISPL ABLEBOND 84-1LMISR4 ABLEBOND 8290 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 30, 2008 Not Applicable Not Applicable (PDF, 24kB) DIE ATTACH ABLESTIK UNISEM ABLEBOND 8200C ABLEBOND 8290 ABLEBOND 84-1LMISR4 ABLEBOND 84-3J ABLEBOND 8006NS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 145kB) DIE ATTACH ABLESTIK CARSEM Ablebond 2600BT Ablebond 8006NS Ablebond 8200C Ablebond 84-1LMISR4 Ablebond 84-3J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH ABLESTIK (FOR AMKOR) Ablebond 2000, Ablebond 2025D, Ablebond 2100A, Ablebond 2300, Ablebond 2053S, Ablebond 3003, Ablebond 3230, Ablebond MC723, Ablebond 8290, Ablebond 8510AA SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) July 6, 2007 Not Applicable Not Applicable (PDF, 38kB) DIE ATTACH ABLESTIK (FOR CIRTEK) Ablebond 2600AT, Ablebond 2600K, Ablebond 8175A, Ablebond 8352L, Ablebond 84-1LMI, Ablebond 84-1LMISR4, Ablebond 84-3, Ablebond 8900NC SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Halogen, Antimony (Sb), Phosphorus (P) April 16, 2008 Not Applicable Not Applicable (PDF, 31kB) DIE ATTACH ABLESTIK (FOR UNISEM) ABLEBOND Types 2025DSI, 2600AT, 2815A, 8006NS, 8200C, 8200TI, 8290, 84-3J, 84-1LMIS, 84-1LMISR4, 84-1LMISNB, SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Beryllium Copper (BeCu), Triphenyl tin (TPT), Tributyl tin (TBT), select Phathalates, Chlorinated flame retardants, Antimonty (Sb) April 29, 2008 Not Applicable Not Applicable (PDF, 39kB) DIE ATTACH HENKEL ABLEBOND 8006NS "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 15, 2008 CE/2008/C2147 SGS (PDF, 210kB) DIE ATTACH HENKEL ABLEBOND 8290 TEST DATA FOR PPM/WT CONTENT OF: Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) December 8, 2008 CE/2008/C0786 SGS (PDF, 202kB) DIE ATTACH HENKEL ABLEBOND 84-1LMISR4 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 8, 2008 CE/2008/B6968B SGS (PDF, 202kB) DIE ATTACH HENKEL CARSEM QMI519 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH HENKEL CARSEM QMI526 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH HENKEL CARSEM QMI529LB SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH HENKEL CARSEM QMI536 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH HENKEL CARSEM QMI-529LB QMI-526 QMI-536 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH HENKEL (FOR AMKOR) QMI536, QMI538, QMI595 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 1, 2007 Not Applicable Not Applicable (PDF, 34kB) DIE ATTACH HENKEL-ABLESTIK OSE ABLEBOND 8390 ABLEBOND 8360 ABLEBOND 8352L ABLEBOND 2600BT ABLEBOND 2600AT ABLEBOND 84-1LMISR4 ABLEBOND 84-3J ABLEBOND 2025NS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 23, 2008 Not Applicable Not Applicable (PDF, 114kB) DIE ATTACH HITACHI AMKOR AMK-02 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) DIE ATTACH HITACHI EN-4900G* SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS) June 18, 2008 Not Applicable Not Applicable (PDF, 131kB) DIE ATTACH HITACHI SPIL EN-4900 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) DIE ATTACH HITACHI SPIL EN-4900 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) DIE ATTACH SUMITOMO CRM-1076E TEST DATA FOR PPM/WT CONTENT OF: Antimony (Sb), Bromine (Br), Chlorine (Cl) July 31, 2008 ATS/GENV/1265/08/sk ALS (PDF, 122kB) DIE ATTACH SUMITOMO AMKOR CRM-1064B SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM-1076E SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM-1076E SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM-1085A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM-1295SA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM-M0261 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM-M0269 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) DIE ATTACH SUMITOMO AMKOR CRM1076E SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) DIE ATTACH SUMITOMO (FOR UNISEM) CRM-1076DJ, CRM-1076NS, CRM-1076R, CRM-1146A SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Tributyl tin (TBT), Triphenyl tin (TPT) April 24, 2008 Not Applicable Not Applicable (PDF, 735kB) DIE ATTACH SUMITOMO (FOR UTL) CRM-1076DJ SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluorooctanoic acid (PFOA) February 12, 2008 Not Applicable Not Applicable (PDF, 532kB) DIE ATTACH ABLESTIK ABLEBOND 8390A SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), PERFLUOROOCTANIC ACID ( PFOA) May 8, 2008 NA NA (PDF, 24kB) Die_Attach_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_11-06-2007 (PDF, 32kB) DIE_ATTACH_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_PFOA_BrClFI_07-06-2007 (PDF, 30kB) Die_Attach_ABLEBOND_15TYPES_SDOC-NON-USE_PFOS+_06-20-2007 (PDF, 45kB) Die_Attach_Ablebond_15TYPES_SDOC-NON-USE_PFOS+_TBBPA_RedP_01-28-2008 (PDF, 40kB) Die_Attach_Ablebond_16-PRODUCTS_SDOC-SUBS-NONUSE_05-07-2007 (PDF, 42kB) DIE_ATTACH_ABLEBOND_17TYPES_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 34kB) DIE_ATTACH_ABLEBOND_2000-8510AA-2300_SDOC-NON-USE_PFOS+_11-06-2007 (PDF, 37kB) Die_Attach_ABLEBOND_7TYPES_SDOC-NON-USE_PFOS_01-11-2008 (PDF, 40kB) Die_Attach_Ablebond_8200C_84-1LMISR4_SDOC-NO-FR-USED_10-25-2007 (PDF, 36kB) DIE_ATTACH_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFAS_02-11-2008 (PDF, 34kB) Die_Attach_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFOA_02-11-2008 (PDF, 31kB) DIE_ATTACH_ASAT-SUMITOMO_CRM-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) DIE_ATTACH_CARSEM-HENKEL_QMI519_SDOC-NON-USE_BrClSb_10-31-2007 (PDF, 125kB) Die_Attach_HANA-ABLEBOND_13TYPES_SDOC-30SUBS-REPORT_02-07-2008 (PDF, 39kB) DIE_ATTACH_HANA-ABLEBOND_SDOC-NON-USE_PFOS_PFAS_09-04-2007 (PDF, 84kB) DIE_ATTACH_HENKEL_QMI2419MA_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 43kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_SDOC-NON-USE_HALOGENS_02-21-2008 (PDF, 364kB) FLUX COOKSON AMKOR WS9160-M7 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) IC绑定线材料的ICP数据(English only) BOND WIRE ANY AMKOR Au HP TYPE Au HTS TYPE Au LOW LOOP SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) BOND WIRE ANY ASE 20um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) BOND WIRE ANY ASE 20um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) BOND WIRE ANY ASE 23um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) BOND WIRE ANY ASE 23um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) BOND WIRE ANY ASE 23um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) BOND WIRE ANY ASE 23um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) BOND WIRE ANY ASE 25um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) BOND WIRE ANY ASE 25um Au TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) BOND WIRE ANY CIRTEK Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) BOND WIRE ANY ISPL Au h 1.0 mil LL HD5 TYPE Au h 1.0 mil LL HD5 TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 28kB) BOND WIRE ANY SPIL Au 1.0 MIL DIAMETER SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) BOND WIRE ANY SPIL Au 1.0 MIL DIAMETER SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) BOND WIRE ANY UNISEM Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 145kB) BOND WIRE HEESUNG AMKOR Au HTS TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.8 +/-0.5um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.8 +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.8HP +/-0.5um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.8HP +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.9HP +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.9HP +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.9JR +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.9S2 +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.9U +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 0.9U +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0H +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0H +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0HP +/-1% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0HP +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0L +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0L +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0U +/-2% SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.0U +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.2H +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.2HP +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.2L +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG AMKOR Au TYPE 1.2U +0.5, -1um SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) BOND WIRE HEESUNG (FOR AMKOR) Au bond wire all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 28, 2007 Not Applicable Not Applicable (PDF, 34kB) BOND WIRE HERAEUS AMKOR Au HTS TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) BOND WIRE HERAEUS AMKOR Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) BOND WIRE HEREAUS ASAT Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) BOND WIRE HEREAUS OSE Au HD5 TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 26kB) BOND WIRE HEREAUS (FOR AMKOR) Au wire types HP, HTS, Low Loop, Long Loop SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 25, 2007 Not Applicable Not Applicable (PDF, 34kB) BOND WIRE HEREAUS (FOR CIRTEK) Au wire, all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorocarbons (PFC), Polychlorinated terphenyl (PCT), Halogenated Diphenyl Methane (HDM), Halogenated aromatic substances, Tetrabromobiphenyl-A (TBBP-A), Perfluorooctane sulfonates (PFOS) no date Not Applicable Not Applicable (PDF, 725kB) BOND WIRE HEREAUS (FOR OSE) Au wire, all types SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluooctyl sulfonates no date Not Applicable Not Applicable (PDF, 162kB) BOND WIRE K&S (FOR UNISEM) Au bond wire, all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctane acid (PFOA), May 20, 2008 Not Applicable Not Applicable (PDF, 38kB) BOND WIRE MALAYSIAN ELECTRONIC MATERIALS (FOR UNISEM) All gold wire types SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) June 13, 2008 Not Applicable Not Applicable (PDF, 75kB) BOND WIRE MEM ASAT Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) BOND WIRE MKE AMKOR Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) BOND WIRE MKE ASAT Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) BOND WIRE MKE (FOR ASAT) Au Bond Wire Type 2N "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 15, 2008 CE/2008/11714D SGS (PDF, 246kB) BOND WIRE TANAKA AMKOR Au GL2 TYPE Au/Pd ALLOY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) BOND WIRE TANAKA AMKOR Au TYPE GPG 0.8 MIL SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 105kB) BOND WIRE TANAKA AMKOR Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) BOND WIRE TANAKA CARSEM 1.0 Au, 1.3 Au, 2.0 Au TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) BOND WIRE TANAKA CARSEM Au 1.0 MIL DIAMETER TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) BOND WIRE TANAKA CARSEM Au 1.3 MIL DIAMETER TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) BOND WIRE TANAKA CARSEM Au 2.0 MIL DIAMETER TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) BOND WIRE TANAKA ISPL Au 1.3 MIL DIAMETER Y TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES November 17, 2008 Not Applicable Not Applicable (PDF, 39kB) BOND WIRE TANAKA ISPL Au 1.3 MIL DIAMETER Y TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 17, 2008 Not Applicable Not Applicable (PDF, 35kB) BOND WIRE TANAKA (FOR AMKOR) Au wire, all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) June 18, 2007 Not Applicable Not Applicable (PDF, 20kB) BOND WIRE TANAKA (FOR UNISEM) Au wire, all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Organic Tin Substances April 28, 2008 Not Applicable Not Applicable (PDF, 185kB) BOND WIRE TANAKA (FOR UTL) Au Wire, all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluorooctyl sulfonates February 27, 2008 Not Applicable Not Applicable (PDF, 38kB) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_6SUBS_R03-10-2008 (PDF, 153kB) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_PFOS+_R20-18-2008 (PDF, 158kB) Bond_Wire_AMKOR-MKE_Au-WIRE_SDOC-CONTENT-USE_8SUBS_01-14-2008 (PDF, 65kB) BOND_WIRE_AMKOR-MKE_AuWIRE-HTS_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) BOND_WIRE_AMKOR-TANAKA_Au-1MILGPG_SDOC-NON-USE_PFOS+_10-05-2007 (PDF, 21kB) Bond_Wire_AMKOR-TANAKA_Au-2TYPES_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 24kB) BOND_WIRE_ASAT-MKE_AuWIRE_SDOC-NON-USE_CdHgCrVI_PBB_PBDE_PFOS_PFAS_01-18-2008 (PDF, 14kB) Bond_Wire_CARSEM-TANAKA_AU-WIRE_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 41kB) Bond_Wire_UTL-TANAKA_SDOC-NON-USE_PFOS_PFOA_06-15-2007 (PDF, 114kB) Gold_Wire_HANA-TANAKA_SDOC-NON-USE_PFOS_ALL-WIRE-TYPES_R01-25-2008 (PDF, 61kB) Gold_Wire_HEREAUS_ALL-WIRE-TYPES_SDOC-NON-USE-6SUBS_12-24-2007 (PDF, 90kB) Gold_Wire_Tanaka_SDOC-NON-USE-TBBPA_ALL-GOLD-BOND-WIRE-TYPES_12-16-2007 (PDF, 157kB) Gold_Wire_Tanaka_SDOC-NON-USE_TBBP-A_12-06-2007 (PDF, 162kB) IC模塑材料的ICP数据(English only) COOKSON SMT-B1-RC SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH15 (PDF, 871kB) GE-100LFC HC100XG-BF1 MP8000CSM SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH15 (PDF, 27kB) MOLD COMPOUND COOKSON ISPL PLASKON CK500A PLASKON CK6510 Series SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 30, 2008 Not Applicable Not Applicable (PDF, 24kB) MOLD COMPOUND COOKSON Plaskon CK6510 series TEST DATA FOR PPM/WT CONTENT OF: Bromine (Br), Chlorine (Cl) September 11, 2008 10137133/08 SGS (PDF, 165kB) MOLD COMPOUND COOKSON Plaskon CK6510A TEST DATA FOR PPM/WT CONTENT OF: Perfluorooctane sulfonates (PFOS) July 8, 2008 10129133/08 SGS (PDF, 200kB) MOLD COMPOUND HITACHI CARSEM CEL9220HF13 GE-100LFC HC100XG-BF1 MP8000CSM SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) MOLD COMPOUND KYOCERA ASE KE-G1270 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) MOLD COMPOUND KYOCERA ASE KE-G1270 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-6300H3L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-660H SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-6730BL SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-7050B SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-7320CR SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-7351T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-7730L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G600 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700A SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700K SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700M SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700Q SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700SM SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G700SP SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G760C SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G760K SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G770SQ SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-G770X SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND MOLD COMPOUND AMKOR EME-S730L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND NITTO AMKOR GC7450K-2 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 399kB) MOLD COMPOUND NITTO AMKOR GE-100L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) MOLD COMPOUND NITTO AMKOR MP8000CH4 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) MOLD COMPOUND NITTO AMKOR GE-100LFCS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) MOLD COMPOUND NITTO CIRTEK GE-300S SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) MOLD COMPOUND NITTO ISPL MP8000AN SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 28kB) MOLD COMPOUND NITTO UNISEM MP-7400EH MP-8000ANF SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 145kB) MOLD COMPOUND NITTO DENKO MP-8000A series "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" July 6, 2008 LPCI/13851/08 SGS (PDF, 214kB) MOLD COMPOUND NITTO DENKO MP-150SG, GC-7450KS-2, BC-7450KM-2, MP-8000AN, MP-8000C, MP-8000CH4, MP-8000CH4-A2, GE-100L, GE-100LFCS, GE-100LFCS-V, GE-100RFC, GE-7470L-A, HC-100XG-BMF, HC-100XJAA, HC-100XJAA-V SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) January 30, 2008 Not Applicable Not Applicable (PDF, 60kB) MOLD COMPOUND NITTO-DENKO MP-180S, MP-8000ANF, MP-8000C, MP8000CHA-E SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA) May 27, 2008 08-05-035 Not Applicable (PDF, 26kB) MOLD COMPOUND SHINETSU AMKOR KMC184-3 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) MOLD COMPOUND SHINETSU ASAT VARIOUS - NOT DEFINED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) MOLD COMPOUND SUMITOMO EME-G600 "TEST DATA FOR PPM/WT CONTENT OF: Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Bromine (Br), Chlorine (Cl), Perfluorooctane sulfonates (PFOS)" July 14, 2008 KA/2008/70647A-01 SGS (PDF, 412kB) MOLD COMPOUND SUMITOMO AMKOR EME-600C EME-6300H EME-G700M EME-6300H3L EME-G700A EME-G700K EME-7320CR EME-G700L EME-6600CS EME-7351T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 3064kB) MOLD COMPOUND SUMITOMO AMKOR EME-7730L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) MOLD COMPOUND SUMITOMO AMKOR EME-G700 EME-G700L EME-G770 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) MOLD COMPOUND SUMITOMO ASAT VARIOUS - NOT DEFINED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) MOLD COMPOUND SUMITOMO ASE EME-G770J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) MOLD COMPOUND SUMITOMO ASE EME-G770J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) MOLD COMPOUND SUMITOMO ASE EME-G770J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) MOLD COMPOUND SUMITOMO ASE EME-G770J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) MOLD COMPOUND SUMITOMO ASE EME-G770J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) MOLD COMPOUND SUMITOMO ASE EME-G770J SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) MOLD COMPOUND SUMITOMO CARSEM EME-6650RL-1L EME-7320AR EME-7730LF EME-G600 EME-G600C EME-G700J EME-G700JA EME-G700L EME-G770HC SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) MOLD COMPOUND SUMITOMO CIRTEK EME-G600 EME-6710S SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) CONTAINS Sb2O3 October 27, 2008 Not Applicable Not Applicable (PDF, 23kB) MOLD COMPOUND SUMITOMO CIRTEK EME-G600 EME-6710S SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) MOLD COMPOUND SUMITOMO EME-G605 Type L SUPPLIER DOCUMENT STATEMENT FOR NON USE/MAX CONTENT OF SUBSTANCES: Cadmium ( Cd), Lead (Pb) , Hexavalent Chromium (CrVI), Mercury ( Hg), Polybrominated Biphenyls (PBB), Polybrominated Diphenly Ether (PBDE) May 5, 2008 KA/2008/50302 SGS (PDF, 200kB) MOLD COMPOUND SUMITOMO EME-G760 Type L SUPPLIER DOCUMENT STATEMENT FOR NON USE/MAX CONTENT OF SUBSTANCES: Cadmium ( Cd), Lead (Pb) , Hexavalent Chromium (CrVI), Mercury ( Hg), Polybrominated Biphenyls (PBB), Polybrominated Diphenly Ether (PBDE), Polychlorinated Biphenyls (PCB), Polychlorinated Napthalanes (PCN), Short Chain Chlorinated Parafins (SCCP) , Mirex, Tetrabromobisphenol A Bis (TBBP-A), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO), Polyvinyl Chloride (PVC), Asbestos, Azo compounds, Formaldehyde, Antimony (Sb), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) May 26, 2008 KA/2008/51724 SGS (PDF, 252kB) MOLD COMPOUND SUMITOMO UNISEM EME-6710S EME-G600 EME-G770HCD SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 145kB) MOLD COMPOUND SUMITOMO (FOR CIRTEK) EME-G600 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) April 3, 2008 Not Applicable Not Applicable (PDF, 335kB) MOLD COMPOUND SUMITOMO (FOR UNISEM) EME-6300H, EME-6600A, EME-6710S type, EME-6730B-L, EME-6730BL, EME-6600HR, EME-7351 type, EME-7351LS, EME-7730LF, EME-G600, EME-G600C, EME-G600KA, EME-E670C, EME-G700M, EME-G700HT, EME-G770HCD SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Tributyl tin (TBT), Triphenyl tin (TPT) April 24, 2008 Not Applicable Not Applicable (PDF, 735kB) MOLD COMPOUND SUMITOMO (FOR UNISEM) EME-G600, EME-G770HT, EME-G770HCD SUPPLIER STATEMENT OF CONTENT FOR SUBSTANCES: Antimony (Sb), Bromine (Br), Chlorine (Cl), Red Phosphorous November 1, 2007 Not Applicable Not Applicable (PDF, 383kB) MOLD COMPOUND SUMITOMO (FOR UTL) EME-6210DS, EME-6600CS, EME-6710SJ, EME-7730LF, EME-G600 TYPE, EME-G605, EME-G605L, EME-G700HA, EME-G700L, EME-G770HCD SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluorooctanoic acid (PFOA) February 12, 2008 Not Applicable Not Applicable (PDF, 632kB) MOLD COMPOUND SUMITOMOT EME-G605 TYPE L TEST DATA FOR PPM/WT CONTENT OF Antimony (Sb), Bromine (Br), Chlorine (Cl) October 27, 2008 ATS/GEL/1485a/08/js SGS (PDF, 123kB) MOLD_COMPOUND_AMKOR-NITTO_15TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 60kB) Mold_Compound_AMKOR-NITTO_MP8000CH4A2_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 63kB) MOLD_COMPOUND_AMKOR-SUMITOMO_26TYPES_SDOC-NON-USE_4SUBS_06-18-2007 (PDF, 35kB) MOLD_COMPOUND_AMKOR-SUMITOMO_8TYPES_SDOC-NON-USE_PFOS+_01-22-2008 (PDF, 507kB) Mold_Compound_ASAT-SUMITOMO_CRN1525D_CRM1076W_EME-G700_SDOC-NON-USE_PFOS_01-22-2008 (PDF, 310kB) MOLD_COMPOUND_ASAT-SUMITOMO_EME-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Mold_Compound_ASAT-SUMITOMO_EME-G770C_EME-G700_SDOC-CONTENT-REPORT_09-13-2004 (PDF, 62kB) Mold_Compound_CARSEM-HITACHI_CEL-92-4TYPES_SDOC-NON-USE_PFOS_01-28-2008 (PDF, 334kB) MOLD_COMPOUND_CARSEM-HITACHI_CEL9220HF&VTYPE_SDOC-NON-USE_BrClSb_10-30-2007 (PDF, 18kB) MOLD_COMPOUND_CARSEM-NITTO_18TYPES_SDOC-NON-USE_PFOS_02-20-2008 (PDF, 216kB) Mold_Compound_CARSEM-SUMITOMO_32TYPES_SDOC-NON-USE_PFOS_01-31-2008 (PDF, 418kB) Mold_Compound_HANA-NITTO_MP-8000CH4_SDOC-CONTENT-REPORT_04-23-2007 (PDF, 112kB) Mold_Compound_HANA-NITTO_SDOC_MP-8000CH4_25SUBS_04-23-2007 (PDF, 112kB) Mold_Compound_HANA-SUMITOMO_9TYPES_SDOC-SUBS-DISCOLOSURE_12-26-2007 (PDF, 552kB) Mold_Compound_HITACHI_4TYPES_SDOC-NON-USE_TBBPA_12-13-2007 (PDF, 23kB) Mold_Compound_HITACHI_CEL-9220HF-4TYPES_SDOC-NON-USE_10SUBS_12-27-2007 (PDF, 390kB) Mold_Compound_ISPL-SUMITOMO_EME-G770HCD_SDOC-NON-USE_PFOS_PCT_TBBPA_12-21-2007 (PDF, 53kB) Mold_Compound_NITTO_6TYPES_SDOC-NON-USE_PFOS+_PFC_TBBPA_RED-P_01-10-2008 (PDF, 214kB) Mold_Compound_NITTO_MOLD-COMPOUND-SDOC_18-TYPES_FOR_TBBPA_BrClSb_12-07-2007 (PDF, 62kB) Mold_Compound_NITTO_MP-8000CH4_SDOC-NON-USE_6SUBS_01-03-2008 (PDF, 206kB) Mold_Compound_NITTO_MP8000AN_SDOC-NON-USE-6SUBS_12-21-2007 (PDF, 59kB) Mold_Compound_OSE-SUMITOMO_5TYPES_SDOC-NON-USE_PFOS_PFOA_02-13-2008 (PDF, 372kB) Mold_Compound_SHINESTU_KMC-385P-8_KMC-385P-14F_SDOC-REPORT-CONTENT_07-05-2007 (PDF, 464kB) Mold_Compound_SHINETSU_KMC-3580P-14F_KMC-3580P-8_SDOC-NON-USE-6SUBS_12-27-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_25SUBS_05-22-2007 (PDF, 568kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_BrCl_06-15-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_TBBPA_DECA-BDE_12-03-2007 (PDF, 304kB) Mold_Compound_SUMITOMO-9TYPES_SDOC-NON-USE_PFOS_R01-25-2008 (PDF, 381kB) Mold_Compound_SUMITOMO_EME-G770HCD_SDOC-NON-USE-4SUBS_12-21-2007 (PDF, 52kB) Mold_Compound_SUMITOMO_SDOC-FOR_EME-7351-TYPE-LS_BrCl_TBBPA_28SUBS_11-08-2007 (PDF, 26kB) Mold_Compound_UTL-SUMITOMO_11TYPES_SDOC-NON-USE_PFOS_PFOA_PFAS_02-12-2008 (PDF, 536kB) SUMITOMO EME-G600 EME-G600C EME-G700 EME-G700L SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH15 (PDF, 38kB) IC表面抛光材料的ICP数据(English only) PLATING AEM ISPL Sn BALL (ANODE) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" October 16, 2008 101401/8(1) SGS (PDF, 177kB) PLATING AEM (FOR ISPL) 100% Sb Ball (for plating) "SUPPLIER DOCUMENT STATEMENT OF CONTENT OF SUBSTANCES: Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" October 6, 2007 Not Applicable Not Applicable (PDF, 52kB) PLATING AIM (FOR CIRTEK) Pure Sn SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) March 3, 2008 Not Applicable Not Applicable (PDF, 61kB) PLATING ANY CIRTEK PURE TIN ANODE Sn/Pb ANODE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) PLATING ANY ISPL Sn/Pb ANODES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 30, 2008 Not Applicable Not Applicable (PDF, 24kB) PLATING ANY UNISEM 100% Sn 85Sn/15Pb SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 145kB) PLATING HOJIN PLATEC AMKOR SnBi OPTION SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) PLATING KOKI UTL PURE TIN BALL "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 4, 2008 BKKH0814553 Intertek (PDF, 2609kB) PLATING KOKI (FOR UNISEM) Plating Materials, all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluorooctyl sulfonates February 27, 2008 Not Applicable Not Applicable (PDF, 326kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 18, 2008 (PDF, 172kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony (Sb), Arsenic (As), Asbestos, Azo, Berylllium (Be), Bismuth (Bi), Bromoniated Flame Retardants other than PBB/PBDE/TBBPA, Cadmium (Cd), Chlorodiphenylmethanem Dichloroethyle, Trichloromethane, Pentachloroethane, Tetrachloromethane, Aliphatic Chlorinated Hydrocarbons (other than PCN/PCB/PCT/SCCP), Short Chain Chlorinated Paraffins (SCCP), Bromodiphenylmethane, Expanded Polystyrene (EPS), Fromaldehyde, Ugilec 121, Ugilec 141, DBBT, Halons, Chlorinated Flurocarbons, HCFC, HBFC, Carbon Tetrachloride, Hydro Fluoro Carbons, Per Fluoro Carbons, Hexavelent Chromium, Lead (Pb), Mercury (Hg), Natural rubber, Nickel (Ni), Palladium, Penta Chloro Phenol (PCP), Perfluorooctane sulfonates (PFOS), Phthalates (DEHP, DBP, DINP, DINP, DNOP, DNHP), Polybrominated Biphenyls (PBB), Polybrominated Diphenlethers (PBDE, PBDO, PBBE, DBDPE, DBDPO), Polychlorinate dBiphenyls (PCB), Polychlorinate terphenyls PCT), Polychlorinated Napthalenes (PCN) Polycyclic Aromatic Hydrocarbons (PAH), Polyvinyl Chloride (PVC), Radioactive substances, Red Phosphorus, Selenium (Se), Tetrabromo bis phenol A (TBBP-A), Tributyltin (TBT), Tributyltin Oxide (TBTO), Triphenlytin (TPT) April 4, 2008 (PDF, 194kB) PLATING ROHM & HASS AMKOR MATTE TIN (ST-380 PROCESS) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) PLATING SCHLOTTER OSE PLATING SOLUTIONS; ACID CONCENTRATE FF, TIN CONCENTRATE FS20, SLOTOTIN 41, NUETRALIZER PT11, DEFLASH DF11 AND TIN ANODE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 24kB) PLATING SCHLOTTER (FOR OSE) Tin Concentrate FS20 "SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 30, 2007 Not Applicable Not Applicable (PDF, 433kB) PLATING STRAITS METAL (FOR UNISEM) 99.9% Sn and 85%Sn/15%Pb solder anodes SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) June 13, 2008 Not Applicable Not Applicable (PDF, 728kB) PLATING TECHNIC ISPL 100% Sn BUTTON SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 125kB) PLATING UNKNOWN CIRTEK FS20 Sn Concentrate ACID CONCENTRATE FF SLOTOTIN 41-1 Sn Additive Pb CONCENTRATE FP SLOTOLET K ADDITIVE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) Plating_ASAT-ROHM&HASS_PLATE-19ITEMS_SDOC-NON-USE_PFOS_PFOA_04-11-2007 (PDF, 233kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_BrCl_10-08-2007 (PDF, 79kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_PFOS_PFOA_01-30-2008 (PDF, 80kB) PLATING_CARSEM-REDRING_SnPb-ANODE_TR6SUBS_02-25-2008 (PDF, 86kB) PLATING_HANA-ASM_Ag-PLATE-PPF_TR6SUBS_01-23-2008 (PDF, 933kB) Plating_ISPL-TECHNIC_6-TIN-PLATE_SDOC-NON-USE_6SUBS_01-30-2008 (PDF, 116kB) PLATING_ISPL-TECHNIC_PURESnBALL_TR6SUBS_01-24-2008 (PDF, 916kB) Plating_OSE-SCHLOETTER_TIN-PLATE-6ITEMS_SDOC_NON-USE_21SUBS_01-27-2008 (PDF, 90kB) PLATING_SCHLOETTER_PLATING_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_06-2007 (PDF, 21kB) Plating_UTL-TECHWIN_SDOC-NON-USE_9SUBS_-2-12-2008 (PDF, 108kB) Surface_Finish_CARSEM-REDRING_ALL-TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 80kB) Surface_Finish_HANA-ULTRACORE_TINPLATE_SDOC-SUBS-DISCLOSURE_01-23-2008 (PDF, 1687kB) IC硅片材料的ICP数据(English only) MAXIM Fabricated wafer (using PFOS containing developer) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Perfluorooctane sulfonates (PFOS), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I)" June 19, 2008 CE/2008/62379A SGS (PDF, 342kB) 焊球的ICP数据(English only) SOLDER BALL ACCUREUS FCI 96.8Sn/2.6Ag/0.6Cu TYPE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 8, 2008 KA/2007/C3117A-01 SGS (PDF, 398kB) SOLDER BALL ANY AMKOR Sn63/Pb37 Sn95.5/Ag4.0/Cu0.5% (SAC405) Sn96.5/Ag3.0/Cu0.5% (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SOLDER BALL ANY ASE 63Sn/37Pb SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SOLDER BALL ANY ASE 63Sn/37Pb SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SOLDER BALL ANY ASE 96.5Sn/3.0Ag/0.4Cu (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SOLDER BALL ANY ASE 96.5Sn/3.0Ag/0.4Cu (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SOLDER BALL ANY ASE 96.5Sn/3.0Ag/0.4Cu (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) SOLDER BALL ANY ASE 96.5Sn/3.0Ag/0.4Cu (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SOLDER BALL ANY ASE 96.5Sn/3.0Ag/0.4Cu (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SOLDER BALL ANY ASE 96.5Sn/3.0Ag/0.4Cu (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) SOLDER BALL ANY CHIPBOND Sn5/Pb95 Sn63/Pb37 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 53kB) SOLDER BALL COOKSON AMKOR Sn63/Pb37 TYPES Sn95.5/Ag4.0/Cu0.5 (SAC405) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SOLDER BALL COOKSON (FOR AMKOR) Types SAC305, SAC405, 63Sn/37Pb, 10Sn/90Pb, 62Sn/36Pb/2Ag SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 15, 2007 Not Applicable Not Applicable (PDF, 25kB) SOLDER BALL DUKSAN HI-METAL (FOR AMKOR) All solder ball types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane no date Not Applicable Not Applicable (PDF, 34kB) SOLDER BALL FUTUREHOVE ASAT VARIOUS - NOT DEFINED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) SOLDER BALL MITSUI AMKOR Sn96.5/Ag3.0/Cu0.5 (SAC305) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SOLDER BALL MKE AMKOR Sn63/Pb37 TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SOLDER BALL MKE (FOR AMKOR) All solder ball types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 1, 2007 Not Applicable Not Applicable (PDF, 33kB) SOLDER BALL MKE (FOR AMKOR) SAC305 ball SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) May 6, 2008 Not Applicable Not Applicable (PDF, 89kB) SOLDER BALL MKE (FOR AMKOR) Sn 63/Pb 37 type SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Cadmium (Cd), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybromineated biphenyl (PBB), Polybrominated diphenly ether (PBDE), Perfluorooctane sulfonates (PFOS) January 11, 2008 Not Applicable Not Applicable (PDF, 79kB) SOLDER BALL NIPPON (FOR MAXIM) LF45/SAC305 solder balls (for uCPS/WLP packages) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), SUPPILER DOCUMENT STATEMENT FOR NON USE OF Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs, Bromine (Br), Chlorine (Cl)" March 31, 2008 JP/2008/031194 SGS (PDF, 147kB) SOLDER BALL PROFOUND ASAT NOT DEFINED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) SOLDER BALL PROFOUND CARSEM 63Sn/37Pb SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SOLDER BALL PROFOUND (FOR CARSEM) Sn63/Pb37 Ball TEST DATA FOR PPM/WT CONTENT OF Aluminum (Al), Antimony (Sb), Arsenic (As), Bismuth (Bi), Cadmium (Cd), Copper (Cu), Gold (Au), Iron (Fe), Indium (In), Lead (Pb), Nickel (Ni), Phosphorous (P), Sulphur (S), Tin (Sn), Zinc (Z) February 5, 2008 KI/2008/10239 SGS (PDF, 678kB) SOLDER BALL PROPRIETARY (FOR CASIO) SAC305 type "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" August 1, 2008 CE/2008/77149 SGS (PDF, 174kB) SOLDER BALL PROPRIETARY (FOR CHIPBOND) Pb 95/Sn 5 type TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI) April 2, 2008 CE/2008/39721 SGS (PDF, 428kB) SOLDER BALL SENJU ASAT VARIOUS - NOT DEFINED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) SOLDER BALL SENJU SPIL SAC305 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) SOLDER BALL SENJU SPIL SAC305 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) SOLDER BALL SENJU SPIL Sn63/Pb37 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 25kB) SOLDER BALL SENJU SPIL Sn63/Pb37 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_SDOC-NON-USE_6SUBS_01-11-2008 (PDF, 79kB) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_TR8SUBS_01-14-2008 (PDF, 302kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_TR9SUBS_01-14-2008 (PDF, 309kB) SOLDER_BALL_AMKOR-MKE_Sn985-Ag1-Cu5_TR9SUBS_01-14-2008 (PDF, 304kB) SOLDER_BALL_ASAT-MKE_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT-8SUBS_01-18-2008 (PDF, 104kB) SOLDER_BALL_ASAT-PMTC_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT_PFOS_01-21-2008 (PDF, 104kB) SOLDER_BALL_ASAT-SENJU_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 26kB) UCSP_SOLDER_BALLS_MAXIM-NIPPON_SUBSTANCES-CONTENT-REPORT_01-09-2008 (PDF, 830kB) 最终产品模塑料数据供应商关于有害物质的声明(English only) Amkor关于有害物质的担保声明 (PDF, 242kB) 材料测试实验室的ISO 17025证书(English only) ALS_chem&bio_17025_cert (PDF, 33kB) ALS_envr_test_17025_cert (PDF, 17kB) Nippon_Micrometal_Corp (PDF, 329kB) SGS_Hong_Kong_Ltd (PDF, 119kB) SGS_Malaysia (PDF, 207kB) SGS_Singapore_Pte_Ltd (PDF, 37kB) SGS_Taiwan_Ltd (PDF, 49kB) 裸片压膜材料测试数据(English only) LAMINATION FILM LINTEC ADWILL LC2850(40) (used for die backside lamination uCSP/WLP) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl)" March 27, 2008 F690501/LF-CTSAYAA08-09224 SGS (PDF, 114kB) LAMINATION FILM PROPRIETARY (FOR CASIO) Proprietary lamination film (used for uCSP/WLP) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" August 1, 2008 CE/2008/77147/08 SGS (PDF, 190kB) PCB覆晶基板材料测试数据(English only) HANA和Mitsubishi Gas Chemical Company关于BT材料的RoHS标准兼容性的说明 (PDF, 12kB) SOLDER BALL SENJU SPIL SAC305 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) SUBSTRATE ANY AMKOR CCL-HL832HS CORE LAMINATE CCL-HL832 CORE LAMINATE SOLDER MASK AUS5 TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SUBSTRATE ANY ASE BT TYPE (10X10X0.53mm) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) SUBSTRATE ANY ASE BT TYPE (10X10X0.53mm) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 30kB) SUBSTRATE ANY ASE BT TYPE (23X23mm) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SUBSTRATE ANY ASE BT TYPE (23X23mm) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SUBSTRATE ANY ASE BT TYPE FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SUBSTRATE ANY ASE BT TYPE FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SUBSTRATE ANY ASE BT TYPE FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SUBSTRATE ANY ASE BT TYPE FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) SUBSTRATE DAISHO SENSHI CARSEM 832EX CORE 832HS CORE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SUBSTRATE EASTERN ASAT BT TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) SUBSTRATE JCI AMKOR CCL-HL832 CORE LAMINATE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SUBSTRATE JCI CARSEM 2 LAYER BT-EL SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SUBSTRATE K. CIRCUIT AMKOR CCL-HL832 CORE LAMINATE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SUBSTRATE KIINSUS CARSEM 2 LAYER BT-ELY 0.56 C0223 CORE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SUBSTRATE KINGBOARD (FOR MAXIM) Pb-Free FR4 CCL/PP 170`C Tg laminate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Medium Chain Chlorinated Paraffins (MCCP), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polychlorinated Terphenyl (PCT), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Phthalates, select Azo, Polyvinyl chloride (PVC), select Halogenated Fluorocarbons (HFC), select Perfluorocarbons (PFC), select Poly Aromatic Hydrocarbons (PAH), Mirex, 2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole, Tetrabromo biphenyl-A (TBBP-A), Perfluorooctane sulfonates (PFOS), Perfluorooctanic Acid (PFOA), Hexabromocyclododecane (HBCDD)" May 23, 2008 CE/2008/54056 SGS (PDF, 2880kB) SUBSTRATE KINSUS AMKOR CCL-HL832 CORE LAMINATE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SUBSTRATE KINSUS SPIL ANY WITH Cu SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) SUBSTRATE KINSUS SPIL ANY WITH Cu SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) SUBSTRATE MITSUBISHI HANA LAMINATE/PREPREG TYPES HL832NX, CCL-830NX, 832NX (TYPE A W/O Cu FOIL), GHPL-830NX GHPL-832NX TYPE A "TEST DATA FOR PPM/WT CONTENT OF: Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Polychlorinted biphenyls (PCB), Polychlorinated naphthalenes (PCN), Short Chain Chlorinated Paraffins (SCCP), Tetrabromobisphenol A (TBBP-A), Tributyl tin (TBT), Triphenyl tin (TPT), Tributyl tin oxide (TBTO), Asbestos, select Azo compounds, select Phthalates, Polychlorinated terphenyls (PCT), PolyChlorinated vinyl (PVC)" March 5, 2000 CE/3008/14670B SGS (PDF, 1172kB) SUBSTRATE MITSUBISHI (FOR AMKOR) CCL-HL830, HL832, HL832EX, HL832HS, HL832NA, HL832MG, HL832NX (TYPE A) Substrate core SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA) May 17, 2007 Not Applicable Not Applicable (PDF, 20kB) SUBSTRATE NANYA PSR4000/AUS308 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I)" February 13, 2008 CE/2008/20308 SGS (PDF, 211kB) SUBSTRATE PPT AMKOR CCL-HL832 CORE LAMINATE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SUBSTRATE SAMSUNG AMKOR CCL-HL832 CORE LAMINATE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SUBSTRATE TAIYO (FOR AMKOR) PSR-4000AUS308/CA-40 AUS308, PSR-4000AUS320/CA-40 AUS320 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), PolyVinyl Chloride (PVC), Antimony Trioxide (Sb3O3), Tributyl Tin (TBT), Tributyl Tin Oxide (TBTO), "Other" Brominated Flame Retardants, Tetrabromobiphenyl A (TBBP-A) November 18, 2007 Not Applicable Not Applicable (PDF, 46kB) SUBSTRATE TRIPOD ASAT BT TYPES SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) SUBSTRATE UMTC AMKOR CCL-HL832 CORE LAMINATE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 17, 2008 Not Applicable Not Applicable (PDF, 871kB) SUBSTRATE UNIMICRON (FOR AMKOR) MCL-E-679FB core SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) January 15, 2008 Not Applicable Not Applicable (PDF, 79kB) SUBSTRATE MITISUBISHI (FOR AMKOR) BT substrate core types CCL-HL830/HL832/HL832EX, HL832HS, HL832NB, HL832MG, HL832NX type A SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctane acid (PFOA), May 28, 2007 N/A N/A (PDF, 24kB) SUBSTRATE MITISUBISHI (FOR AMKOR) CCL-HL832 Core SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Tetrabromobisphenol A (TBBP-A ), Antimony and it's compounds, Tributyl tin (TBT), Tributyl tin oxide (TBTO), Polyvinyl chloride (PVC), other Brominated Flame Retardants July 19, 2007 N/A N/A (PDF, 73kB) SUBSTRATE TAIYO (FOR AMKOR) PSR-4000 AUS308/CA-40 AUS308, PSR-4000 AUS320/CA-40 AUS320 SOLDER MASK SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Tetrabromobisphenol A (TBBP-A ), Antimony and it's compounds, Tributyl tin (TBT), Tributyl tin oxide (TBTO), Polyvinyl chloride (PVC), other Brominated Flame Retardants June 18, 2007 N/A N/A (PDF, 46kB) SUBSTRATE TAIYO (FOR AMKOR) Solder Mask types PSR-4000 AUS5/CA-40 AUS2, PSR-4000 AUS303/CA-40 AUS303, PSR-4000 AUS308/CA-40 AUS308, PSR-4000 AUS320/CA-40 AUS320 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) April 26, 2007 62-0178 N/A (PDF, 199kB) SUBSTRATE UMC + HITACHI (FOR AMKOR) Subtrate core type MCL-E679FB SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) January 15, 2008 N/A N/A (PDF, 20kB) SUBSTRATES_AMKOR-MITSUBISHI-UNIMICRON_BT-21TYPES_SDOC-NON-USE_PFOS_06-22-2007 (PDF, 36kB) SUBSTRATES_ASAT-ASE_5TYPES_SDOC-NON-USE_PFOS_10-31-2007 (PDF, 79kB) SUBSTRATES_HANA_HL832HS-TF-NXA_AUS303_AUS308_SDOC-27SUBS_12-25-2007 (PDF, 1829kB) SUBSTRATE_CORE_MITSUBISHI_HL-832-SERIES_GHPL-830-SERIES_SDOC-NON-USE_DECA-BDE_TBBP-A_09-10-2007 (PDF, 18kB) SUBSTRATE_HANA-KINSUS_LGA-3TYPES_SDOC-CONTENT_PFOS_PFOA_BrClFI_REDP_TBBPA_01-10-2008 (PDF, 45kB) SUBSTRATE_HANA-KINSUS_LGASUBSTRATES-3TYPES_SDOC-CONTENT_PFOS_PFOA_BrClFI_RedP_TBBPA_02-05-2008 (PDF, 45kB) 用于特定产品的材料测试数据(English only) 080807_Pb95Sn5_FlipChip_ROHS (PDF, 274kB) 080807_Sn63Pb37_FlipChip_ROHS_HF (PDF, 310kB) CIRTEK_ASSY_ALL-PRODUCTS_SDOC-NON-USE_15SUBS_02-01-2008 (PDF, 20kB) DEVICE SPECIFIC PROPRIETARY FCI FCI's PROPRIETARY PROCESS AND MATERIALS FOR uCSP/WLP PACKAGES SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) September 18, 2008 Not Applicable Not Applicable (PDF, 27kB) DEVICE SPECIFIC Various/Proprietary (FOR/FROM CHIPBOND) Pb 95/Sn 5 type solder ball + BCB 4026-46 + Cu Target + Ti Target for flip chip packages SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) August 25, 2008 Not Applicable Not Applicable (PDF, 36kB) DEVICE SPECIFIC Various/Proprietary (FOR/FROM CHIPBOND) Sn 63/Pb 37 type solder ball + BCB coated dummy wafer (flip chip packages) SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) August 25, 2008 Not Applicable Not Applicable (PDF, 36kB) EPSON WLP/uCSP 10 PROCESSES FOR FAB OF MAXIM PRODUCT SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 17, 2008 (PDF, 46kB) ISPL_TDFN-TQFN-SOT-TSOT_SDOC-NON-USE_6SUBS_R02-06-2008 (PDF, 11kB) STATSCHIPPAC_SDOC-NON-USE-PROCESS_PFOS_01-28-2008 (PDF, 17kB) UTAC_ASSEMBLY_DEVICES_SDOC-PFOS-NON-USE_01-07-2008 (PDF, 62kB) UTL_SPECIFIC-PRODS-TQFN-TDFN-TSSOP-PKGS_SDOC-NON-USE_12-06-2007 (PDF, 160kB) 底层填充材料测试数据(English only) UNDERFILL CHIPCOAT CARSEM U8429-1-MAX SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) UNDERFILL HENKEL (FOR AMKOR) FP0108(CNB8610-19), FP4544, FP4547, FP4549HV, CB260AT SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 1, 2007 Not Applicable Not Applicable (PDF, 34kB) UNDERFILL HYSOL CARSEM FP4549 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) UNDERFILL_CARSEM-HENKEL_SDOC_FP4530&4549_02-01-2008 (PDF, 41kB) 涂层材料测试数据(English only) BCB_DOW-CYCLOTENE-4026-46-RESIN_DATASHEET-CONTENT_05-21-1998 (PDF, 8kB) COATING CASIO WLP Liquid Epoxy-1 TEST DATA FOR PPM/WT CONTENT OF Antimony (Sb), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) May 26, 2008 CE/2008/57210A SGS (PDF, 878kB) COATING CASIO WLP Polyimide Coat TEST DATA FOR PPM/WT CONTENT OF Antimony (Sb), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Phosphorous (P) June 2, 2008 JP/2008/050878 SGS (PDF, 84kB) COATING DOW CHIPBOND CYCLOTENE 2026-46 (BCB) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 53kB) COATING DOW (FOR CHIPBOND) Cyclotene 4022-35, 4024-40, 4025-46, XUS 35078.00 Resin type "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 7, 2008 CE/2008/45766A SGS (PDF, 502kB) COATING DOW (FOR MAXIM) Cyclotene 4022-35, 4024-40, 4026-46, XUS 35078.00 Resin type "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs) SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl)" May 7, 2008 CE/2008/45766A SGS (PDF, 458kB) COATING DOW CORNING CARSEM Q3-6646 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) November 20, 2008 Not Applicable Not Applicable (PDF, 27kB) COATING PROPRIETARY (FOR CASIO) Polyimide "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" August 1, 2008 CE/2008/77145 SGS (PDF, 196kB) COATING PROPRIETARY (FOR CASIO) WLP Resin #1 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" August 1, 2008 CE/2008/77143 SGS (PDF, 206kB) COATING SUMITOMO CRC-8601, CRC-8602 SUPPLIER DOCUMENT STATEMENT FOR NON USE/MAX CONTENT OF SUBSTANCES: Bromine (Br), Chlorine (Cl) August 25, 2008 Not Applicable Not applicable (PDF, 23kB) COATING SUMITOMO (FOR MAXIM) CRC-8601, CRC-8620 Resin type SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) August 8, 2008 Not Applicable Not Applicable (PDF, 40kB) COATING SUMITOMO (FOR MAXIM) CRC-8620 Resin type "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" March 22, 2007 JP/2007/030665 SGS (PDF, 84kB) COATING Various/Proprietary (FOR/FROM CHIPBOND) Cyclotene 4026-46 resin type SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) August 25, 2008 Not Applicable Not Applicable (PDF, 36kB) 重新分层材料测试数据(English only) 液体密封剂材料测试数据(English only) 080507_FP4451_ROHS (PDF, 113kB) 080507_PF4451_HF (PDF, 113kB) 080612_CBO260AT_ROHS (PDF, 113kB) ENCAPSULANT HENKEL AMKOR CB0260-AT SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) ENCAPSULANT HENKEL (FOR AMKOR) FP4450, FP4451, EO1016, EO8000, CB062AT SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 1, 2007 Not Applicable Not Applicable (PDF, 34kB) ENCAPSULANT HYSOL AMKOR FP4451 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) ENCAPSULANT LOCTITE SPIL FP4451 FP4800 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable ENCAPSULANT LOCTITE SPIL FP4451 FP4800 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) ENCAP_HENKEL_FP4451_FP4549_MCL-200C_SDOC-NON-USE_PFOS_11-02-2007 (PDF, 48kB) ENCAP_LOCTITE-HYSOL_CNB925-4_DATASHEET_05-2003 (PDF, 116kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_SODC-CONTENT_PFOS_10-31-2007 (PDF, 40kB) 助熔剂材料测试数据(English only) FLUX AIM (FOR CIRTEK) Flux - all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) March 3, 2008 Not Applicable Not Applicable (PDF, 61kB) FLUX COOKSEN ASAT NOT DEFINED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) November 5, 2008 Not Applicable Not Applicable (PDF, 85kB) FLUX COOKSON AMKOR WS3018AA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) FLUX COOKSON AMKOR WS3018FS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) FLUX COOKSON AMKOR WS3018LV SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) FLUX COOKSON AMKOR WS600RED SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) FLUX COOKSON AMKOR WS609 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP), PLUS 289 OTHER SUBSTANCES NOT LISTED Not Applicable Not Applicable (PDF, 129kB) FLUX COOKSON Types NR310B, WS3018LV, RMA376EHLV, WS600RED, WS609, ES9160-M7 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 15, 2007 Not Applicable Not Applicable (PDF, 25kB) FLUX COOKSON (FOR AMKOR) WS-609 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) January 16, 2008 Not Applicable Not Applicable (PDF, 25kB) FLUX INDIUM (FOR MAXIM) 5R "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I)" April 8, 2008 CE/2008/40075 SGS (PDF, 319kB) FLUX UNKNOWN CIRTEK 2164 TYPE 145 TYPE SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 27, 2008 Not Applicable Not Applicable (PDF, 27kB) FLUX PROPRIETARY (FOR CASIO)(USED FOR uCSP/WLP PACKAGES) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Chlorine (Cl) February 28, 2008 NA NA (PDF, 39kB) 焊膏材料测试数据(English only) SOLDER PASTE AIM (FOR CIRTEK) Solder paste, Bar and wire solder - all types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) March 3, 2008 Not Applicable Not Applicable (PDF, 61kB) SOLDER PASTE COOKSON (FOR AMKOR) Types ES341CPS 96.5 Sn/3.5Ag, WS609 63Sn/37Pb SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctanoic acid (PFOA), Chlorinated Solvents, Hexachlorethane June 15, 2007 Not Applicable Not Applicable (PDF, 25kB) SOLDER PASTE HENKEL CARSEM 94Sn/5Sb CR32 AGS88 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SOLDER PASTE INDIUM CARSEM INDALLOY 133 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) SOLDER/SOLDER PASTE PROPRIETARY (FOR CASIO) USED FOR uCSP/WLP PACKAGES) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Chlorine (Cl) February 28, 2008 NA NA (PDF, 38kB) 电池材料测试数据(English only) BATTERIES PANASONIC Types BR, CR, BR-A series, VL, ML, ML-R, NBL, MT series, CGR series, CGA series, HHR series, HHF series, AM, LR, ZR series "SUPPLIER STATEMENT OF CONTENT FOR SUBSTANCES: Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" July 3, 2006 Not Applicable Not Applicable (PDF, 28kB) HEATSLUG ANY ASE Cu/Ni/CHROME FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) 散热器、散热片、散热装置材料测试数据(English only) HEATSLUG ANY AMKOR BLACK OXIDE FINISH SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) HEATSLUG ANY ASE Cu/Ni/CHROME FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) HEATSLUG ANY ASE Cu/Ni/CHROME FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) HEATSLUG ANY ASE Cu/Ni/CHROME FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) HEATSLUG ANY ASE Cu/Ni/CHROME FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) HEATSLUG ANY ASE Cu/Ni/CHROME FOR 23X23MM HSBGA SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 24, 2008 Not Applicable Not Applicable (PDF, 16kB) HEATSPREADER KINSUS SPIL Cu BASED HEATSPREADERS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) HEATSPREADER KINSUS SPIL Cu BASED HEATSPREADERS SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony Trioxide (Sb2O3), Red Phosphorous, Phosphorous, TPP (Triphenyl Phosphate), Poly Vinyl Chloride (PVC), Polychlorinated dibenzofurans, Polybrominated Dibenzofurans, Vinyl Chloride, Poly Aromatic Hydrocarbons (PAH), Pentachlorophenol (PCP), Hexachlorocyclohexane (HCH), Monomethyltetrachloro Diphenyl Methane, Monomethyldichloro Diphenyl Methane, Monomethyldibromo Diphenyl Methane, EPS (Expanded Polystyrene) October 28, 2008 Not Applicable Not Applicable (PDF, 24kB) 粘接材料测试数据 DIE ATTACH HITACHI AMKOR AMK-02 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) LID ADHESIVE ABLESTIK AMKOR ABLEBOND 2000T SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB) LID ADHESIVE ABLESTIK AMKOR DOW 7920 SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES for REACH 16 SVCH Oct 2008 Candidate Listing: Anthracene, 4,4'-diaminodiphenylmethane, Dibutyl phthalate (DBP), Cyclododecane, Cobalt dichloride, Diarsenic pentaoxide, Diarsenic trioxide, Sodium dichromate dihydrate, 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene), Bis (2-ethyl(hexyl)phthalate) (DEHP), Hexabromocyclododecane (HBCDD), Short chain chlorinated paraffins (SCCPs), Bis(tributyltin)oxide, Lead hydrogen arsenate, Triethyl arsenate, Benzyl butyl phthalate (BBP) October 21, 2008 Not Applicable Not Applicable (PDF, 27kB)