材料测试数据文件

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	Maxim > EMMI > 材料测试数据文件

	材料测试数据文件包装材料包装材料清单倒装芯片的ICP数据(English only) Flip_Chip_Backside_Lamination_Lintec_LC2850_13-MAY-2005 (PDF, 447kB) 喷镀物ICP数据(English only) Sputtering_Targets_Copper_03-JULY-2007 (PDF, 122kB) Sputtering_Targets_for_UBM (PDF, 50kB) Sputtering_Targets_TITANIUM_4SUBS_09-28-2007 (PDF, 205kB) WLP_Sputtering_Targets_and_Sn/Pb_Plating_Anodes_10-15-06.pdf (PDF, 128kB) BCB材料的ICP数据(English only) BCB_CYCLOTENE_4024-40_DATASHEET (PDF, 20kB) BCB_EPOXY-4024_6SUBS_08-23-07 (PDF, 196kB) BCB_Resin_PBB_PBDE (PDF, 90kB) BCB_Resin_Pb_Cr+6_Hg_Cd (PDF, 42kB) 打印用油墨的ICP数据(English only) BRANDING_INK_INK_TYPE_B (PDF, 129kB) INK_BONMARQUE_C-SERIES-Ag_UV-WHITE_UV-BLACK_UV4-BLACK_UV-Ag_CdPb&USE-NONUSE-SUBS_03-12-2007 (PDF, 978kB) INK_MARKEM-7224-BLACK-65-A_TR6SUBS_11-20-2007 (PDF, 14kB) INK_MARKEM_13TYPES_SDOC-NON-USE_PFOS_04-10-2008 (PDF, 96kB) INK_MARKEM_4461-BLACK_TR6SUBS_12-24-2004 (PDF, 111kB) INK_MARKEM_4466-WHITE_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_4488-BLACK&WHITE_SDOC-NON-USE_PFOS+_02-13-2008 (PDF, 48kB) INK_MARKEM_4496-WHITE_TR6SUBS_11-20-2007 (PDF, 14kB) INK_MARKEM_7224-GREYF_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7261-BLACK_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7281-BLACK_TR6SUBS_03-27-2008 (PDF, 44kB) INK_MARKEM_7281-GREY479J_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7281-GREY479J_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_9060-WHITE&7281-BLACK_SDOC-CONTENT_6SUBS_03-21-2008 (PDF, 40kB) INK_MARKEM_9060-WHITE-EXH_TR6SUBS_03-21-2008 (PDF, 14kB) INK_MARKEM_9060-WHITE_TR6SUBS_03-27-2008 (PDF, 44kB) INK_OSE-APPLIED-INNOTECH_M238_6SUBS_06-18-2007 (PDF, 60kB) IC引线框架材料的ICP数据(English only) ASM (FOR ISPL) COPPER A194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 28, 2008 KA/2008/10990A-01R2 SGS (PDF, 524kB) DYNACRAFT (FOR CARSEM) COPPER C194 WITH SPOT SILVER PLATE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 31, 2008 LPCI/24550/07 SGS (PDF, 224kB) LEADFRAMES_AMKOR-ACQUTEK_5TYPES_SDOC-NON-USE_8SUBS_03-03-2008 (PDF, 110kB) LEADFRAMES_AMKOR-LGMICRON_SDOC-NON-USE_PFOS_11-13-2007 (PDF, 325kB) LEADFRAMES_AMKOR-POONGSAN_C914R-MULTITYPES_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 22kB) Leadframes_AMKOR-POSSEHL_SPOT-Ag-A194_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 37kB) LEADFRAMES_AMKOR-QPL_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 161kB) LEADFRAMES_AMKOR-SAMSUNG-TECHWIN_C194-SPOTAg_TR9SUBS_02-25-2008 (PDF, 106kB) LEADFRAMES_AMKOR-SHINKO_16PDIP_SDOC-NON-USE_PFOS_PFAS_02-12-2008 (PDF, 27kB) LEADFRAMES_AMKOR-SUMIKO_SDOC-NON-USE_PFOS+_01-31-2008 (PDF, 29kB) Leadframes_Amkor_EFTEC64T (PDF, 156kB) Leadframes_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) Leadframes_ASM_SDOC_8SUBS-NON-USE_01-10-2008 (PDF, 479kB) Leadframes_ASM_Technology_A194_1-29-07 (PDF, 144kB) Leadframes_CARSEM-DYNACRAFT_16TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 1200kB) LEADFRAMES_CARSEM-DYNACRAFT_ALLOY42-SPOTAg-TYPES_6SUBS_01-30-2008 (PDF, 145kB) LEADFRAMES_CARSEM-DYNACRAFT_TR44SUBS_08-31-2007 (PDF, 540kB) Leadframes_Dynacraft_Industries_C104_Ag_Spot_31-JAN-2007 (PDF, 272kB) Leadframes_Dynacraft_Industries_C151_C7025_C194_Alloy 42 (PDF, 179kB) Leadframes_Dynacraft_SDOC-NON-USE_TBBPA_16-LEADFRAME-TYPES_12-10-2007 (PDF, 45kB) LEADFRAMES_HANA-ASM_CuA194_TR6SUBS_01-28-2008 (PDF, 975kB) LEADFRAMES_HANA-JADE_CuC194-AgSPOT_TR6SUBS_01-18-2008 (PDF, 249kB) Leadframes_HANA-JADE_SDOC-NON-USE-8SUBS_01-16-2008 (PDF, 19kB) LEADFRAMES_HANA-MITSUHITEC_CuA194-AgPLATE_TR6SUBS_03-12-2007 (PDF, 89kB) LEADFRAMES_HANA-QPL_Cu194-AgPLATE_TR6SUBS_04-02-2007 (PDF, 221kB) Leadframes_Hana_BT_Substrates_ML_HL_GMPL_and_GHPL_Series (PDF, 615kB) LEADFRAMES_ISPL-ASM_ALL-TYPES_SDOC-NON-USE_6SUBS_01-31-2007 (PDF, 244kB) LEADFRAMES_ISPL-ASM_CuA194-AgPLATE_6SUBS_01-30-2007 (PDF, 630kB) LEADFRAMES_ISPL-ASM_CuA194-AgPLATE_TR6SUBS_01-29-2007 (PDF, 47kB) LEADFRAMES_ISPL-ASM_CuA194_SDOC-NON-USE_6SUBS_01-31-2008 (PDF, 143kB) Leadframes_Mitsubishi_CCL-H_HL-830NB_832NB_830NX_832NX_ GHPL-830NB_832NB_830NX_832NX_10-JAN-2006 (PDF, 144kB) Leadframes_MITSUI_PDIP-8&14L-300MIL_SDOC-NON-USE-10SUBS_12-27-2007 (PDF, 86kB) Leadframes_NSEB_A194 (PDF, 299kB) Leadframes_NSEB_Cu-C194-Spot-Ag_Sumitomo_6subs_08-06-2007 (PDF, 254kB) Leadframes_OSE-DYNACRAFT_SPOT-Ag-CuC7025-TSSOP-TYPES_6SUBS_05-18-2007 (PDF, 193kB) LEADFRAMES_OSE-POONGSAN_ALL-TYPES_SDOC-NON-USE_PFOS_PFAS_03-19-2008 (PDF, 92kB) Leadframes_OSE-POONGSAN_CuC194-TSOC-TYPES_6SUBS_05-04-2007 (PDF, 248kB) LEADFRAMES_OSE-SAMSUNG-TECHWIN_SPOTAg-CuC194_TR6SUBS-BrCl-PFOS_02-25-2008 (PDF, 103kB) Leadframes_OSEP-SAMSUNG_CuC194-SOIC-TYPES_6SUBS_05-11-2007 (PDF, 117kB) Leadframes_Poongsan_Microtec_Corp_CuAlloy_C194_07-FEB-2007 (PDF, 116kB) Leadframes_QPL_Limited_194_NiPdAu_Plating_02-APR-2007 (PDF, 216kB) Leadframes_QPL_SDOC_7SUBS-NON-USE_01-11-2008 (PDF, 143kB) LEADFRAMES_SCS-ASM_C7025_SpotAg_6SUBS_01-29-2007 (PDF, 345kB) Leadframes_Silver Plated_C7025 (PDF, 137kB) Leadframes_Taiyo_PSR-4000_18-MAY-2006 (PDF, 94kB) Leadframes_Tatsuta_BT_Substrates_AE-1125HD_18-AUG-2006 (PDF, 254kB) Leadframes_UTL-DYNACRAFT_CuC7025-SPOT-Ag_6SUBS_05-18-2007 (PDF, 198kB) LEADFRAME_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) LEADFRAME_ASAT-QPL_C194-AgPLATE+AE_TR6SUBS_04-02-2007 (PDF, 216kB) LEADFRAME_CARSEM-DYNACRAFT_CuC7025-SPOTAg_TR44SUBS_01-12-2007 (PDF, 462kB) Leadframe_NSEB_Cu-C194-Spot-Ag_Sumitomo_6subs_08-06-2007 (PDF, 274kB) LEADREAMES_OSE-DYNACRAFT_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_02-12-2008 (PDF, 78kB) POONGSAN (FOR AMKOR) COPPER C194 WITH SPOT SILVER PLATE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 4, 2007 F690501/LF-CTSULP07-00777 SGS (PDF, 248kB) QPL (FOR ASAT) ALL TYPES COPPER C7025 WITH AE SURFACE TREATMENT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 3, 2008 EC407789606 SGS (PDF, 276kB) QPL (FOR ASAT) COPPER C7025 WITH AE SURFACE TREATMENT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Bromine (Br), Chlorine (Cl)" April 3, 2008 EC407789606 SGS (PDF, 276kB) 芯片粘接材料的ICP数据(English only) ABLESTIK ABLEBOND 8390A SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), PERFLUOROOCTANIC ACID ( PFOA) May 8, 2008 NA NA (PDF, 24kB) ABLESTIK ABLEBOND 8390A TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) July 3, 2007 CE/2007/65666 SGS (PDF, 277kB) ABLESTIK ABLEBOND 8390A TEST DATA FOR PPM/WT CONTENT OF: Cadmium (Cd), Hexavalent Chromium (CrVI), Lead (Pb), Mercury (Hg), Polybrominated biphenyl (PBB), Polybrominated diphenyl ether (PBDE) December 12, 2007 CE/2007/C1552 SGS (PDF, 331kB) Ablestik_SDOC-NON-USE-OF_PFOS_09-04-2007 (PDF, 83kB) Ablestik_SDOC-NON-USE_PFC-PFOS-4OTHERS_FOR-8290_8200T_84-1LMISR4_12-17-2007 (PDF, 40kB) Ablestik_SDOC-NON-USE_TBBPA_ABLEBOND_14-TYPES-DIE-ATTACH_12-03-2007 (PDF, 35kB) Ablestik_SDOC_ABLEBOND_84-1LMISR4_8390A_2200D_8006NS_SbBrCl_09-26-2007 (PDF, 99kB) Die_Attaches_All_Ablestik_Products (PDF, 72kB) DIE_ATTACH_ABLEBOND-8290_BrClFI_12-12-2007 (PDF, 170kB) Die_Attach_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_11-06-2007 (PDF, 32kB) DIE_ATTACH_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_PFOA_BrClFI_07-06-2007 (PDF, 30kB) Die_Attach_ABLEBOND_15TYPES_SDOC-NON-USE_PFOS+_06-20-2007 (PDF, 45kB) Die_Attach_Ablebond_15TYPES_SDOC-NON-USE_PFOS+_TBBPA_RedP_01-28-2008 (PDF, 40kB) Die_Attach_Ablebond_16-PRODUCTS_SDOC-SUBS-NONUSE_05-07-2007 (PDF, 42kB) DIE_ATTACH_ABLEBOND_17TYPES_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 34kB) DIE_ATTACH_ABLEBOND_2000-8510AA-2300_SDOC-NON-USE_PFOS+_11-06-2007 (PDF, 37kB) DIE_ATTACH_ABLEBOND_2000_TR6SUBS_12-10-2007 (PDF, 324kB) Die_Attach_Ablebond_2025D_6subs_02-07-2007 (PDF, 228kB) Die_Attach_Ablebond_2033SC_6SUBS_11-30-2007 (PDF, 326kB) Die_Attach_ABLEBOND_2033SC_BrClFI_11-30-2007 (PDF, 306kB) Die_Attach_Ablebond_2200D_6SUBS_11-30-2007 (PDF, 185kB) Die_Attach_ABLEBOND_2200D_BrClFISb_11-30-2007 (PDF, 107kB) DIE_ATTACH_ABLEBOND_2300_TR6SUBS_12-12-2007 (PDF, 347kB) DIE_ATTACH_ABLEBOND_2600BT_TR6SUBS_12-10-2007 (PDF, 184kB) DIE_ATTACH_ABLEBOND_2600BT_TRBrClPSb_11-19-2007 (PDF, 280kB) Die_Attach_Ablebond_3230_6SUBS_12-12-2007 (PDF, 353kB) Die_Attach_ABLEBOND_7TYPES_SDOC-NON-USE_PFOS_01-11-2008 (PDF, 40kB) Die_Attach_Ablebond_8006NS_6SUBS_12-05-2007 (PDF, 341kB) Die_Attach_ABLEBOND_8006NS_BrClFI_12-05-2007 (PDF, 303kB) DIE_ATTACH_ABLEBOND_8006NS_TRBrClFI_01-10-2008 (PDF, 104kB) Die_Attach_Ablebond_8006_1-10-07 (PDF, 260kB) Die_Attach_Ablebond_8200C_6SUBS_11-30-2007 (PDF, 189kB) Die_Attach_Ablebond_8200C_84-1LMISR4_SDOC-NO-FR-USED_10-25-2007 (PDF, 36kB) Die_Attach_Ablebond_8200T_6SUBS_11-30-2007 (PDF, 185kB) Die_Attach_Ablebond_8200T_BrClFI_07-31-2007 (PDF, 106kB) Die_Attach_Ablebond_8290_6SUBS_12-12-2007 (PDF, 185kB) Die_Attach_Ablebond_8361J_6SUBS_12-10-2007 (PDF, 309kB) DIE_ATTACH_ABLEBOND_84-1LMISNB_TRBrClFI_12-03-2007 (PDF, 307kB) Die_Attach_Ablebond_84-1LMISR4_6SUBS_12-10-2007 (PDF, 185kB) DIE_ATTACH_ABLEBOND_84-1LMISR4_BrClFI_12-10-2007 (PDF, 193kB) Die_Attach_Ablebond_84-1LMISR4_ClFBrI_07-03-2007 (PDF, 284kB) Die_Attach_Ablebond_84-1LMISR4_MULTISUBS_12-03-2007 (PDF, 295kB) DIE_ATTACH_ABLEBOND_84-3J_6SUBS_12-03-2007 (PDF, 186kB) DIE_ATTACH_ABLEBOND_84-3J_BrClFI_07-03-2007 (PDF, 302kB) DIE_ATTACH_ABLEBOND_8600_6SUBS_11-30-2007 (PDF, 348kB) DIE_ATTACH_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFAS_02-11-2008 (PDF, 34kB) Die_Attach_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFOA_02-11-2008 (PDF, 31kB) DIE_ATTACH_ASAT-SUMITOMO_CRM-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Die_Attach_CARSEM-HENKEL_QMI-591&536_02-01-2008 (PDF, 41kB) DIE_ATTACH_CARSEM-HENKEL_QMI519_SDOC-NON-USE_BrClSb_10-31-2007 (PDF, 125kB) Die_Attach_HANA-ABLEBOND_13TYPES_SDOC-30SUBS-REPORT_02-07-2008 (PDF, 39kB) DIE_ATTACH_HANA-ABLEBOND_SDOC-NON-USE_PFOS_PFAS_09-04-2007 (PDF, 84kB) DIE_ATTACH_HENKEL_QMI2419MA_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 43kB) DIE_ATTACH_HENKEL_QMI519_TR6SUBS_07-19-2007 (PDF, 128kB) Die_Attach_Henkel_QMI529LB_6Subs_07-12-2007 (PDF, 121kB) DIE_ATTACH_HENKEL_QMI536_TR6SUBS_01-18-2008 (PDF, 837kB) DIE_ATTACH_HITACHI_EN4900-F-1_TR6SUBS_02-23-2005 (PDF, 39kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_6SUBS_06-19-2007 (PDF, 161kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_SDOC-NON-USE_HALOGENS_02-21-2008 (PDF, 364kB) Die_Attach_OSEP-HITACHI_EN-4900G_6SUBS_05-28-2007 (PDF, 165kB) DIE_ATTACH_SUMITOMO_CRM-1525D_TR6SUBS_12-27-2007 (PDF, 337kB) Die_Attach_Sumitomo_CRM1076E (PDF, 49kB) IC绑定线材料的ICP数据(English only) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_6SUBS_R03-10-2008 (PDF, 153kB) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_PFOS+_R20-18-2008 (PDF, 158kB) BOND_WIRE_AMKOR-HERAEUS_AuWIRE_TR6SUBS_05-28-2007 (PDF, 588kB) Bond_Wire_AMKOR-MKE_Au-WIRE_PFOS_05-02-2007 (PDF, 105kB) Bond_Wire_AMKOR-MKE_Au-WIRE_SDOC-CONTENT-USE_8SUBS_01-14-2008 (PDF, 65kB) BOND_WIRE_AMKOR-MKE_AuWIRE-2N_TR91SUBS_01-15-2008 (PDF, 645kB) BOND_WIRE_AMKOR-MKE_AuWIRE-HTS_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) BOND_WIRE_AMKOR-TANAKA_Au-1MILGPG_SDOC-NON-USE_PFOS+_10-05-2007 (PDF, 21kB) Bond_Wire_AMKOR-TANAKA_Au-2TYPES_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 24kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-BrClFISb_01-16-2008 (PDF, 139kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-PFOS-PFOA_02-21-2008 (PDF, 125kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-R6SUBS_01-04-2008 (PDF, 154kB) BOND_WIRE_ASAT-MKE_AuWIRE-TYPE4N_TR6SUBS_08-13-2007 (PDF, 227kB) BOND_WIRE_ASAT-MKE_AuWIRE_SDOC-NON-USE_CdHgCrVI_PBB_PBDE_PFOS_PFAS_01-18-2008 (PDF, 14kB) Bond_Wire_CARSEM-TANAKA_AU-WIRE_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 41kB) BOND_WIRE_CIRTEK-HERAEUS_Au-BOND-WIRE_6SUBS_01-22-2008 (PDF, 55kB) BOND_WIRE_ISPL-HEREAUS_AuWIRE_22SUBS_07-13-2007 (PDF, 775kB) BOND_WIRE_ISPL-TANAKA_AuWIRE_TR6SUBS_01-05-2007 (PDF, 129kB) BOND_WIRE_MKE_AuWIRE_PFOS_05-02-2007 (PDF, 105kB) Bond_Wire_OSEP-HERAEUS_AU-TYPES-HD2BE-HD5CE-HD6CA_6SUBS_01-22-2008 (PDF, 55kB) BOND_WIRE_SC-K&S_AuWIRE-RADIX-3N_TR6SUBS_10-12-2007 (PDF, 398kB) BOND_WIRE_SCS-K&S_Au-AW14_6SUBS_12-25-2007 (PDF, 415kB) BOND_WIRE_SCS-TANAKA_Au_6SUBS_01-04-2008 (PDF, 148kB) BOND_WIRE_SPIL-SUMITOMO_Au-NLF-NLF1-NLFA_TR4MET_04-04-2005 (PDF, 40kB) BOND_WIRE_SPIL-SUMITOMO_Au-NLF-NLF1-NLFA_TR4MET_04-04-2005 (PDF, 40kB) Bond_Wire_UTL-TANAKA_SDOC-NON-USE_PFOS_PFOA_06-15-2007 (PDF, 114kB) Gold_Wire_Carsem-TANAKA_ALL_TYPES_6SUBS_08-13-2007 (PDF, 187kB) Gold_Wire_HANA-TANAKA_SDOC-NON-USE_PFOS_ALL-WIRE-TYPES_R01-25-2008 (PDF, 61kB) Gold_Wire_Heraeus_Oriental_Hitec_Co._Au_Wire_02-FEB-2007 (PDF, 99kB) Gold_Wire_HEREAUS_ALL-WIRE-TYPES_SDOC-NON-USE-6SUBS_12-24-2007 (PDF, 90kB) Gold_Wire_MK_Electron_Co._4N_16-JAN-2007 (PDF, 202kB) Gold_Wire_Tanaka_4N_6SUBS_01-05-2007 (PDF, 129kB) Gold_Wire_Tanaka_ALL_TYPES_01-04-2008 (PDF, 151kB) Gold_Wire_TANAKA_ClFBrI_Sb2O3_07-17-2006 (PDF, 305kB) Gold_Wire_Tanaka_NSEB_05-JAN-2007 (PDF, 128kB) Gold_Wire_Tanaka_SDOC-NON-USE-TBBPA_ALL-GOLD-BOND-WIRE-TYPES_12-16-2007 (PDF, 157kB) Gold_Wire_Tanaka_SDOC-NON-USE_TBBP-A_12-06-2007 (PDF, 162kB) Gold_Wire_Tanaka_SGS_Labs_6-13-06 (PDF, 125kB) HERAEUS (FOR AMKOR) GOLD (Au) BOND WIRE TYPES HA3, HA5, HA6, HA9, H10 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 22, 2008 LF-CTSQYA08_01753 SGS (PDF, 55kB) IC模塑材料的ICP数据(English only) ENCAP_HENKEL_FP4451_FP4549_MCL-200C_SDOC-NON-USE_PFOS_11-02-2007 (PDF, 48kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_SODC-CONTENT_PFOS_10-31-2007 (PDF, 40kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_TR11SUBS_06-29-2007 (PDF, 106kB) MOLD_COMPOUND_AMKOR-NITTO_15TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 60kB) Mold_Compound_AMKOR-NITTO_MP8000CH4A2_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 63kB) MOLD_COMPOUND_AMKOR-SUMITOMO_26TYPES_SDOC-NON-USE_4SUBS_06-18-2007 (PDF, 35kB) MOLD_COMPOUND_AMKOR-SUMITOMO_8TYPES_SDOC-NON-USE_PFOS+_01-22-2008 (PDF, 507kB) Mold_Compound_ASAT-SUMITOMO_CRN1525D_CRM1076W_EME-G700_SDOC-NON-USE_PFOS_01-22-2008 (PDF, 310kB) MOLD_COMPOUND_ASAT-SUMITOMO_EME-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Mold_Compound_ASAT-SUMITOMO_EME-G770C_EME-G700_SDOC-CONTENT-REPORT_09-13-2004 (PDF, 62kB) Mold_Compound_CARSEM-HITACHI_CEL-92-4TYPES_SDOC-NON-USE_PFOS_01-28-2008 (PDF, 334kB) MOLD_COMPOUND_CARSEM-HITACHI_CEL9220HF&VTYPE_SDOC-NON-USE_BrClSb_10-30-2007 (PDF, 18kB) MOLD_COMPOUND_CARSEM-NITTO_18TYPES_SDOC-NON-USE_PFOS_02-20-2008 (PDF, 216kB) Mold_Compound_CARSEM-SUMITOMO_32TYPES_SDOC-NON-USE_PFOS_01-31-2008 (PDF, 418kB) Mold_Compound_CEL_9200BC_01-JUN-2006 (PDF, 529kB) Mold_Compound_EME-6600H.pdf (PDF, 330kB) Mold_Compound_EME-G600_6SUBS_10-02-2007 (PDF, 258kB) Mold_Compound_HANA-NITTO_MP-8000CH4_SDOC-CONTENT-REPORT_04-23-2007 (PDF, 112kB) Mold_Compound_HANA-NITTO_SDOC_MP-8000CH4_25SUBS_04-23-2007 (PDF, 112kB) Mold_Compound_HANA-SUMITOMO_9TYPES_SDOC-SUBS-DISCOLOSURE_12-26-2007 (PDF, 552kB) Mold_Compound_HITACHI_4TYPES_SDOC-NON-USE_TBBPA_12-13-2007 (PDF, 23kB) Mold_Compound_HITACHI_CEL-9220HF-4TYPES_SDOC-NON-USE_10SUBS_12-27-2007 (PDF, 390kB) Mold_Compound_Hitachi_CEL9220HF13_29-JUN-2007 (PDF, 219kB) Mold_Compound_ISPL-SUMITOMO_EME-G770HCD_SDOC-NON-USE_PFOS_PCT_TBBPA_12-21-2007 (PDF, 53kB) Mold_Compound_KMC-184-7_12-MAR-2007 (PDF, 233kB) Mold_Compound_NITTO_6TYPES_SDOC-NON-USE_PFOS+_PFC_TBBPA_RED-P_01-10-2008 (PDF, 214kB) Mold_Compound_Nitto_GE-100series_6Subs_04-13-2007 (PDF, 276kB) Mold_Compound_NITTO_MOLD-COMPOUND-SDOC_18-TYPES_FOR_TBBPA_BrClSb_12-07-2007 (PDF, 62kB) Mold_Compound_NITTO_MP-8000CH4_SDOC-NON-USE_6SUBS_01-03-2008 (PDF, 206kB) Mold_Compound_Nitto_MP7400_Series_07-AUG-2006 (PDF, 134kB) MOLD_COMPOUND_NITTO_MP8000-Aseries_6SUBS_07-20-2007 (PDF, 149kB) MOLD_COMPOUND_NITTO_MP8000-Aseries_6SUBS_07-26-2007 (PDF, 149kB) Mold_Compound_NITTO_MP8000AN_SDOC-NON-USE-6SUBS_12-21-2007 (PDF, 59kB) Mold_Compound_Nitto_MP8000A_Series_01-AUG-2006 (PDF, 125kB) Mold_Compound_Nitto_MP8000C_Series_12-MAR-2007 (PDF, 241kB) Mold_Compound_Nitto_Products (PDF, 49kB) Mold_Compound_OSE-SUMITOMO_5TYPES_SDOC-NON-USE_PFOS_PFOA_02-13-2008 (PDF, 372kB) MOLD_COMPOUND_SHINESTU_KMC-3580-P_6SUBS_05-16-2007 (PDF, 408kB) Mold_Compound_SHINESTU_KMC-385P-8_KMC-385P-14F_SDOC-REPORT-CONTENT_07-05-2007 (PDF, 464kB) Mold_Compound_SHINETSU_KMC-3580P-14F_KMC-3580P-8_SDOC-NON-USE-6SUBS_12-27-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_25SUBS_05-22-2007 (PDF, 568kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_BrCl_06-15-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_TBBPA_DECA-BDE_12-03-2007 (PDF, 304kB) Mold_Compound_SUMITOMO-9TYPES_SDOC-NON-USE_PFOS_R01-25-2008 (PDF, 381kB) Mold_Compound_Sumitomo_EME-6300H_6SUBS_03-27-2007 (PDF, 107kB) MOLD_COMPOUND_SUMITOMO_EME-6300H_TR6SUBS_02-20-2008 (PDF, 220kB) Mold_Compound_Sumitomo_EME-6600A_6SUBS_03-29-2006 (PDF, 128kB) MOLD_COMPOUND_SUMITOMO_EME-6600A_TR6SUBS_03-03-2008 (PDF, 454kB) MOLD_COMPOUND_SUMITOMO_EME-6600CR_6SUBS_03-21-2007 (PDF, 108kB) Mold_Compound_Sumitomo_EME-6600CS_6SUBS_08-20-2007 (PDF, 289kB) Mold_Compound_Sumitomo_EME-6600HR_6SUBS_08-13-2007 (PDF, 291kB) Mold_Compound_Sumitomo_EME-6600RA_6SUBS_07-05-2007 (PDF, 571kB) Mold_Compound_Sumitomo_EME-6710SJ_6SUBS_01-09-2007 (PDF, 558kB) Mold_Compound_Sumitomo_EME-6710S_6SUBS_07-31-2007 (PDF, 1064kB) Mold_Compound_Sumitomo_EME-6730B_6SUBS_05-07-2007 (PDF, 295kB) Mold_Compound_Sumitomo_EME-7351LS_6SUBS_06-28-2007 (PDF, 388kB) Mold_Compound_Sumitomo_EME-7730LF_6SUBS_08-27-2007 (PDF, 293kB) Mold_Compound_Sumitomo_EME-7730L_6subs_02-26-2007 (PDF, 348kB) Mold_Compound_Sumitomo_EME-7730L_EME-6300SR_EME-6650RL_EME-7720T_EME-S351TQ_and_EME-S730_11-04-2003 (PDF, 2400kB) MOLD_COMPOUND_SUMITOMO_EME-G600-TYPEC_TR6SUBS_02-05-2008 (PDF, 337kB) Mold_Compound_Sumitomo_EME-G600C_6SUBS_02-26-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G600_6SUBS_08-20-2007 (PDF, 290kB) Mold_Compound_SUMITOMO_EME-G600_BrCl_06-21-2007 (PDF, 117kB) Mold_Compound_Sumitomo_EME-G600_SbClBr_06-07-2007 (PDF, 260kB) Mold_Compound_Sumitomo_EME-G605L_6SUBS_03-23-2007 (PDF, 107kB) Mold_Compound_Sumitomo_EME-G605_SbClBr_10-20-2007 (PDF, 200kB) Mold_Compound_Sumitomo_EME-G700A_6SUBS_03-07-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G700CA_6SUBS_01-30-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G700E_6SUBS_03-12-2007 (PDF, 94kB) Mold_Compound_Sumitomo_EME-G700HA_6SUBS_08-17-2006 (PDF, 283kB) Mold_Compound_Sumitomo_EME-G700J_6SUBS_05-03-2007 (PDF, 257kB) Mold_Compound_Sumitomo_EME-G700K_6SUBS_11-07-2006 (PDF, 138kB) Mold_Compound_Sumitomo_EME-G700K_SbClBr_11-05-2007 (PDF, 246kB) Mold_Compound_Sumitomo_EME-G700L_6SUBS_08-21-2007 (PDF, 454kB) Mold_Compound_Sumitomo_EME-G700L_SbClBr_11-05-2007 (PDF, 114kB) MOLD_COMPOUND_SUMITOMO_EME-G700L_TRBrClSb_11-05-2007 (PDF, 114kB) Mold_Compound_Sumitomo_EME-G700M_6SUBS_08-13-2007 (PDF, 295kB) Mold_Compound_Sumitomo_EME-G700M_SbClBr_11-05-2007 (PDF, 114kB) Mold_Compound_Sumitomo_EME-G700_6SUBS_08-08-2007 (PDF, 387kB) Mold_Compound_Sumitomo_EME-G700_ClBr_08-22-2007 (PDF, 1667kB) Mold_Compound_Sumitomo_EME-G760_6SUBS_01-22-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G770C_6SUBS_04-02-2007 (PDF, 335kB) MOLD_COMPOUND_SUMITOMO_EME-G770C_TR6SUBS_04-02-2007 (PDF, 339kB) Mold_Compound_Sumitomo_EME-G770HCD_6SUBS_03-23-2007 (PDF, 107kB) MOLD_COMPOUND_SUMITOMO_EME-G770HCD_6SUBS_06-18-2007 (PDF, 278kB) Mold_Compound_SUMITOMO_EME-G770HCD_BrClFSb_05-28-2007 (PDF, 289kB) Mold_Compound_Sumitomo_EME-G770HCd_SbClBr_06-07-2007 (PDF, 264kB) Mold_Compound_SUMITOMO_EME-G770HCD_SbFClBr_05-28-2007 (PDF, 289kB) Mold_Compound_SUMITOMO_EME-G770HCD_SDOC-NON-USE-4SUBS_12-21-2007 (PDF, 52kB) Mold_Compound_Sumitomo_EME-G770HC_6SUBS_08-27-2007 (PDF, 292kB) Mold_Compound_Sumitomo_EME-G770H_6SUBS_05-25-2006 (PDF, 325kB) Mold_Compound_Sumitomo_EME-G770H_Type-CD_6subs_03-23-2007 (PDF, 109kB) MOLD_COMPOUND_SUMITOMO_EME-G770_TR6SUBS_10-09-2007 (PDF, 150kB) Mold_Compound_SUMITOMO_SDOC-FOR_EME-7351-TYPE-LS_BrCl_TBBPA_28SUBS_11-08-2007 (PDF, 26kB) Mold_Compound_UTL-SUMITOMO_11TYPES_SDOC-NON-USE_PFOS_PFOA_PFAS_02-12-2008 (PDF, 536kB) SHINETSU KMC184-7 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 25, 2008 LPCI/03475/08 SGS (PDF, 221kB) SUMITOMO EME-6300 TYPE H3L "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 8, 2008 KA/2008/40050 SGS (PDF, 476kB) SUMITOMO EME-G700 TYPE K "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 20, 2007 20205402C/07 (1) SGS (PDF, 155kB) SUMITOMO EME-G700 TYPE K TEST DATA FOR PPM/WT CONTENT OF: Antimony (Sb), Bromine (Br), Chlorine (Cl) November 5, 2007 ATS/GEL/697/07/sk ALS (PDF, 246kB) 模塑料ICP分析摘要 IC表面抛光材料的ICP数据(English only) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ACID HC, SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY, SOLDERON TIN CONCENTRATE TEST DATA FOR PPM/WT CONTENT OF: Cadmium (Cd), Hexavalent Chromium (CrVI), Lead (Pb), Mercury (Hg), Polybrominated biphenyl (PBB), Polybrominated diphenyl ether (PBDE) December 12, 2007 EC407642601 SGS (PDF, 245kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 18, 2008 (PDF, 172kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony (Sb), Arsenic (As), Asbestos, Azo, Berylllium (Be), Bismuth (Bi), Bromoniated Flame Retardants other than PBB/PBDE/TBBPA, Cadmium (Cd), Chlorodiphenylmethanem Dichloroethyle, Trichloromethane, Pentachloroethane, Tetrachloromethane, Aliphatic Chlorinated Hydrocarbons (other than PCN/PCB/PCT/SCCP), Short Chain Chlorinated Paraffins (SCCP), Bromodiphenylmethane, Expanded Polystyrene (EPS), Fromaldehyde, Ugilec 121, Ugilec 141, DBBT, Halons, Chlorinated Flurocarbons, HCFC, HBFC, Carbon Tetrachloride, Hydro Fluoro Carbons, Per Fluoro Carbons, Hexavelent Chromium, Lead (Pb), Mercury (Hg), Natural rubber, Nickel (Ni), Palladium, Penta Chloro Phenol (PCP), Perfluorooctane sulfonates (PFOS), Phthalates (DEHP, DBP, DINP, DINP, DNOP, DNHP), Polybrominated Biphenyls (PBB), Polybrominated Diphenlethers (PBDE, PBDO, PBBE, DBDPE, DBDPO), Polychlorinate dBiphenyls (PCB), Polychlorinate terphenyls PCT), Polychlorinated Napthalenes (PCN) Polycyclic Aromatic Hydrocarbons (PAH), Polyvinyl Chloride (PVC), Radioactive substances, Red Phosphorus, Selenium (Se), Tetrabromo bis phenol A (TBBP-A), Tributyltin (TBT), Tributyltin Oxide (TBTO), Triphenlytin (TPT) April 4, 2008 (PDF, 194kB) Plating_ASAT-ROHM&HASS_PLATE-19ITEMS_SDOC-NON-USE_PFOS_PFOA_04-11-2007 (PDF, 233kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_BrCl_10-08-2007 (PDF, 79kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_PFOS_PFOA_01-30-2008 (PDF, 80kB) PLATING_CARSEM-REDRING_SnPb-ANODE_TR6SUBS_02-25-2008 (PDF, 86kB) PLATING_CIRTEK-SCHLOETTER_PURESn-PLATE_6SUBS_03-19-2007 (PDF, 679kB) PLATING_HANA-ASM_Ag-PLATE-PPF_TR6SUBS_01-23-2008 (PDF, 933kB) PLATING_ISPL-AEM_PURESn_TR6SUBS_10-04-2007 (PDF, 195kB) Plating_ISPL-TECHNIC_6-TIN-PLATE_SDOC-NON-USE_6SUBS_01-30-2008 (PDF, 116kB) PLATING_ISPL-TECHNIC_PURE-TIN_6SUBS_03-21-2007 (PDF, 204kB) PLATING_ISPL-TECHNIC_PURESnBALL_TR6SUBS_01-24-2008 (PDF, 916kB) Plating_OSE-SCHLOETTER_TIN-PLATE-6ITEMS_SDOC_NON-USE_21SUBS_01-27-2008 (PDF, 90kB) Plating_OSEP-SCHLOTER_TIN_4SUBS_01-30-2007 (PDF, 437kB) PLATING_SCHLOETTER_PLATING_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_06-2007 (PDF, 21kB) PLATING_SCS-SCHLOETTER_Sn99-99ANODE_6SUBS_03-21-2007 (PDF, 668kB) PLATING_UTL-KOKI_SnANODE_TR6SUBS_12-11-2007 (PDF, 3184kB) PLATING_UTL-KOKI_SnANODE_TR6SUBS_12-11-2007 (PDF, 3184kB) Plating_UTL-TECHWIN_SDOC-NON-USE_9SUBS_-2-12-2008 (PDF, 108kB) REDRING (FOR CARSEM) PURE TIN ANODE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 31, 2007 LPCI/24763/07 SGS (PDF, 93kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 ANTIOXIDANT FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009604 SGS (PDF, 243kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 PRIMARY FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009602 SGS (PDF, 244kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 SECONDARY FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009603 SGS (PDF, 243kB) Surface_Finish_ASAT_Leadfree_Solderon_ST200 (PDF, 28kB) Surface_Finish_CARSEM-REDRING_ALL-TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 80kB) Surface_Finish_Carsem_Leadfree_Solder_Ball (PDF, 96kB) Surface_Finish_HANA-ULTRACORE_TINPLATE_SDOC-SUBS-DISCLOSURE_01-23-2008 (PDF, 1687kB) Surface_Finish_HANA-ULTRACORE_TIN_SDOC-NON-USE_PFOS_PFAS_06-27-2007 (PDF, 61kB) Surface_Finish_Koki_Products_Tin_Pure_Metal_05-APR-2007 (PDF, 748kB) Surface_Finish_Redring_Solder_Pure_Tin_Solder_Anode_27-MAR-2007 (PDF, 197kB) Surface_Finish_Rohm_Haas_Electronic_Materials_ST380_Solderon_Process_Solutions_14-FEB-2007 (PDF, 193kB) IC硅片材料的ICP数据(English only) Silicon_Wafer_03-JULY-2007 (PDF, 118kB) 焊球的ICP数据(English only) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_SDOC-NON-USE_6SUBS_01-11-2008 (PDF, 79kB) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_TR8SUBS_01-14-2008 (PDF, 302kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_TR9SUBS_01-14-2008 (PDF, 309kB) SOLDER_BALL_AMKOR-MKE_Sn985-Ag1-Cu5_TR9SUBS_01-14-2008 (PDF, 304kB) SOLDER_BALL_ASAT-MKE_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT-8SUBS_01-18-2008 (PDF, 104kB) SOLDER_BALL_ASAT-PMTC_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT_PFOS_01-21-2008 (PDF, 104kB) SOLDER_BALL_ASAT-SENJU_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 26kB) SOLDER_BALL_CASIO-WLCSP_BUMP_4SUBS_07-23-2007 (PDF, 73kB) SOLDER_BALL_SPIL-SENJU_Sn63Pb37-SPARKLE-BALL_TR12SUBS_03-22-2005 (PDF, 385kB) SOLDER_BALL_SPIL-SENJU_SnAgCu-ECO-M705_TR12SUBS_03-22-2005 (PDF, 397kB) SOLDER_BALL_UTL-KOKI_39TYPES-PbFREE_TR6SUBS_12-11-2007 (PDF, 3184kB) UCSP_Solder_Balls_6sub_07-20-2007 (PDF, 116kB) UCSP_SOLDER_BALLS_MAXIM-NIPPON_SUBSTANCES-CONTENT-REPORT_01-09-2008 (PDF, 830kB) 最终产品模塑料数据供应商关于有害物质的声明(English only) Amkor关于有害物质的担保声明 (PDF, 242kB) 材料测试实验室的ISO 17025证书(English only) ALS_chem&bio_17025_cert (PDF, 33kB) ALS_envr_test_17025_cert (PDF, 17kB) Nippon_Micrometal_Corp (PDF, 329kB) SGS_Hong_Kong_Ltd (PDF, 119kB) SGS_Malaysia (PDF, 207kB) SGS_Taiwan_Ltd (PDF, 49kB) 裸片压膜材料测试数据(English only) LAMINATION_TAPE_CASIO-WLCSP_6SUBS_07-23-2007 (PDF, 233kB) Maxim_Adwill_LC2850(40)_Postcure_6subs_07-06-2007 (PDF, 67kB) Maxim_Adwill_LC2850(40)_Precure_6subs_07-06-2007 (PDF, 66kB) maxim_adwill_LC2850(50)_postcure_6subs_07-06-2007.pdf (PDF, 67kB) maxim_adwill_LC2850(50)_precure_6subs_07-06-2007.pdf (PDF, 66kB) PCB覆晶基板材料测试数据(English only) HANA和Mitsubishi Gas Chemical Company关于BT材料的RoHS标准兼容性的说明 (PDF, 12kB) SUBSTRATES_AMKOR-MITSUBISHI-UNIMICRON_BT-21TYPES_SDOC-NON-USE_PFOS_06-22-2007 (PDF, 36kB) SUBSTRATES_ASAT-ASE_5TYPES_SDOC-NON-USE_PFOS_10-31-2007 (PDF, 79kB) SUBSTRATES_HANA_HL832HS-TF-NXA_AUS303_AUS308_SDOC-27SUBS_12-25-2007 (PDF, 1829kB) SUBSTRATE_CORE_MITSUBISHI_HL-832-SERIES_GHPL-830-SERIES_SDOC-NON-USE_DECA-BDE_TBBP-A_09-10-2007 (PDF, 18kB) SUBSTRATE_CORE_MITSUBISHI_TYPES_CCL-H_HL830HS_832HS_GHPL-830HS_832HS_6SUB_10-23-2007 (PDF, 344kB) SUBSTRATE_CORE_MITSUBISHI_TYPES_CCL-H_HL830TF_832TF_GHPL-803TF_832TF_6SUBS_10-23-2007 (PDF, 323kB) SUBSTRATE_CORE_SPIL-MITSUBISHI_4TYPES_TR6SUBS_10-14-2004 (PDF, 341kB) SUBSTRATE_HANA-KINSUS_HL-832TF&HS_AUS303_HL-832NX-A_AUS308_8SUBS_REPORT_01-10-2008 (PDF, 46kB) SUBSTRATE_HANA-KINSUS_LGA-3TYPES_SDOC-CONTENT_PFOS_PFOA_BrClFI_REDP_TBBPA_01-10-2008 (PDF, 45kB) SUBSTRATE_HANA-KINSUS_LGASUBSTRATES-3TYPES_SDOC-CONTENT_PFOS_PFOA_BrClFI_RedP_TBBPA_02-05-2008 (PDF, 45kB) SUBSTRATE_SOLDERMASK-INK_TAIYO_ASUS303-CA40-WHITE_PBB-PBDE_03-15-2007 (PDF, 196kB) SUBSTRATE_SOLDERMASK_TAIYO_PSR-4000-ASUS303_CdPbHgCr6_04-24-2007 (PDF, 178kB) 用于特定产品的材料测试数据(English only) CIRTEK_ASSY_ALL-PRODUCTS_SDOC-NON-USE_15SUBS_02-01-2008 (PDF, 20kB) DS1386-P-8-120_composite_6subs_11-26-2007 (PDF, 230kB) EPSON WLP/uCSP 10 PROCESSES FOR FAB OF MAXIM PRODUCT SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 17, 2008 (PDF, 46kB) ISPL_TDFN-TQFN-SOT-TSOT_SDOC-NON-USE_6SUBS_R02-06-2008 (PDF, 11kB) MAX8676ELM_SbAsBrClFl-Phthalates_11-13-2007 (PDF, 106kB) MD_ASE_VSC452XHW-02 (PDF, 85kB) MD_CASIO-WLCSP_MAX2131S-SERIES_PbFREE_10-01-2007 (PDF, 83kB) MD_CASIO-WLCSP_MAX2160-SERIES_Pb-FREE_11-15-2005 (PDF, 83kB) MD_CASIO-WLCSP_MAX2163S-SERIES_PbFREE_10-04-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX2839S-SERIES_PbFREE_10-02-2007 (PDF, 85kB) MD_CASIO-WLCSP_MAX3229-SERIES_PbFREE_10-02-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX3302-SERIES_PbFREE_10-04-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX4760-SERIES_PbFREE_10-04-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX4970-SERIES_PbFREE_10-04-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX8676-SERIES_PbFREE_06-25-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX8805-SERIES_PbFREE_03-27-2007 (PDF, 83kB) MD_VSC410KM (PDF, 13kB) MD_VSC410XKM (PDF, 12kB) MD_VSC7150RW_VSC7150RW-B_VSC7150RW-C_VSC7150RW-D_VSC7160R2-B_VSC7160RW-C_VSC7160RW-D_VSC7160RW_AMK_10-19-2005 (PDF, 26kB) MD_VSC7150XRW-D_VSC7160XRW-C_VSC7160XRW-D_AMK_07-04-2005 (PDF, 28kB) MD_VSC7153SS-02_AMK_01-24-2006 (PDF, 22kB) MD_VSC7153XSS_VSC7153XSS-02_AMK_01-24-2006 (PDF, 23kB) MD_VSC7153XYT_VSC7153XYT-B_AMK_07-15-2005 (PDF, 21kB) MD_VSC7153XYT_VSC7156XYT-02_VSC7156XYT-03_ASAT_04-11-2007 (PDF, 29kB) MD_VSC7153YT-B_VSC7153YT_AMK_07-15-2005 (PDF, 24kB) MD_VSC7154XYS_ASAT_07-14-2006 (PDF, 26kB) MD_VSC7154XYS_VSC7154XYS-B_AMK_07-15-2005 (PDF, 21kB) MD_VSC7154YS_ASAT_09-04-2007 (PDF, 34kB) MD_VSC7154YS_VSC7154YS-B_AMK_07-15-2005 (PDF, 24kB) MD_VSC7155HN_AMK_10-21-2005 (PDF, 20kB) MD_VSC7155VU-02_AMK_09-04-2006 (PDF, 32kB) MD_VSC7155XVU_AMK_07-25-2005 (PDF, 20kB) MD_VSC7157XYS_SPIL_11-22-2006 (PDF, 17kB) MD_VSC7157YS_SPIL_11-22-2006 (PDF, 17kB) MD_VSC7158HT_VSC7158HT-02_VSC7158HT-03_ASEK_04-17-2007 (PDF, 31kB) MD_VSC7158XHT_VSC7158XHT-02_ASEK_04-20-2007 (PDF, 31kB) MD_VSC7161HK_AMK_10-04-2005 (PDF, 32kB) MD_VSC7161XHK_AMK_10-04-2005 (PDF, 31kB) MD_VSC7170XYQ_VSC7171XYQ_VSC7172XYQ_VSC7172XYQ-B_AMK_08-10-2005 (PDF, 25kB) MD_VSC7170YQ_VSC7170YQ-01_VSC7171YQ_VSC7172YQ_AMK_08-10-2005 (PDF, 29kB) MD_VSC7173XYI_VSC7177XYI_AMK_08-08-2005 (PDF, 21kB) MD_VSC7173YI_VSC7177YI_VSC7175YI_AMK_06-13-2005 (PDF, 23kB) MD_VSC7174VI_VSC7174VI-02_VSC7174VI-D_VSC7174VI-S1_VSC7174VI-01_VSC7174VI-P_VSC7174VI-S2_AMK_07-25-2005 (PDF, 31kB) MD_VSC7174XVI-02_VSC7174XVI-D_AMK_07-25-2005 (PDF, 31kB) STATSCHIPPAC_SDOC-NON-USE-PROCESS_PFOS_01-28-2008 (PDF, 17kB) UTAC_ASSEMBLY_DEVICES_SDOC-PFOS-NON-USE_01-07-2008 (PDF, 62kB) UTL_SPECIFIC-PRODS-TQFN-TDFN-TSSOP-PKGS_SDOC-NON-USE_12-06-2007 (PDF, 160kB) 底层填充材料测试数据(English only) UNDERFILL_CARSEM-HENKEL_FP4530&4549_02-01-2008 (PDF, 41kB) 涂层材料测试数据(English only) BCB_DOW-CYCLOTENE-4026-46-RESIN_DATASHEET-CONTENT_05-21-1998 (PDF, 8kB) COATINGS_CASIO-WLCSP_POLYIMIDE_6SUBS_07-23-2007 (PDF, 295kB) COATINGS_CASIO-WLCSP_RESIN_6SUBS_07-23-2007 (PDF, 232kB) 重新分层材料测试数据(English only) RDL_CASIO-WLCSP_Cu_4SUBS_07-23-2007 (PDF, 73kB) Material Test Data for Liquid Encapsulants ENCAP_LOCTITE-HYSOL_CNB925-4_DATASHEET_05-2003 (PDF, 116kB) ENCAP_LOCTITE-HYSOL_FP4451_TR6SUBS_05-14-2004 (PDF, 96kB) Material Test Data for Flux CASIO UNKNOWN (USED FOR uCSP/WLP PACKAGES) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Chlorine (Cl) February 28, 2008 NA NA (PDF, 39kB) Material Test Data for Solder Paste CASIO UNKNOWN (USED FOR uCSP/WLP PACKAGES) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Chlorine (Cl) February 28, 2008 NA NA (PDF, 38kB)

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