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EMMI
> 材料测试数据文件
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材料测试数据文件
包装材料
- PACKING MATERIALS DouYee (FOR MAXIM) Humidity Indicator Card (HIC) types - DYE051015JDE, DYE051015WO, DYE10-S, HC0AEC826004NE, HC-MS20003, HI051015, HI051060, HI102030, HI1040, HI1060, HM04, MS123, MS234, MS05015, MS051060, DY-HIC-DYE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 26, 2007 1011369/07(4) SGS
(PDF, 171kB)
喷镀物ICP数据(English only)
- SPUTTERING TARGET PROPRIETARY (FOR CASIO) Copper (Cu) (used for uCSP/WLP packages) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Perfluorooctane sulfonates (PFOS), Tributyl Tin (TBT), Triphenyl Tin (TPT)" June 10, 2008 CE/2008/59181 SGS
(PDF, 491kB)
- SPUTTERING TARGET PROPRIETARY (FOR CASIO) Titanium (Ti) (used for uCSP/WLP packages) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I)" May 31, 2007 CE/2007/56820 SGS
(PDF, 206kB)
打印用油墨的ICP数据(English only)
- INK MARKEM 4488 Black "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A)" July 18, 2007 CE/2007/72436 SGS
(PDF, 364kB)
IC引线框架材料的ICP数据(English only)
- LEADFRAMES LG MICRON (FOR AMKOR) Cu C194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC)" November 16, 2007 KA/2007/B0623 SGS
(PDF, 728kB)
- LEADFRAMES LG MICRON (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl tin oxide (TBTO), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC), Asbestos" November 16, 2007 KA/2007/B0622 SGS
(PDF, 719kB)
- LEADFRAMES SAMSUNG-TECHWIN (FOR AMKOR, OSE & UTL) Cu C194 Preplated "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Perfluorooctane sulfonates (PFOS)" February 25, 2008 F690501/LF-CTSAYA08-04338R1 SGS
(PDF, 270kB)
- LEADFRAMES SUMIKO (FOR AMKOR) Cu A194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Arsenic (As), Selenium (Se), Bismuth (Bi), Beryllium (Be), Polyvinyl chloride (PVC), select Phthalates, select Perfluorocarbons (PFC), select Chlorinated Fluorocarbons (CFC), select Halons, select HCFC, select HBFC" February 2, 2008 CA/2007/C2818R3 SGS
(PDF, 2012kB)
- LEADFRAMES SUMIKO (FOR AMKOR) Cu C7025 w/Ag spot plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Phthalates, select Azo, Mirex, Arsenic (As), Beryllium (Be), Bismuth (Bi), Selenium (Se), Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC), select Perfluorocarbons (PFC), select Chlorinated Fluorocarbons (CFC), select Halons, select HCFC, select HBFC" February 12, 2008 KA/2007/C2817R3 SGS
(PDF, 1992kB)
- LEADFRAMES SUMIKO (FOR AMKOR) EFTEC64T w/Ag spot plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Phthalates, select Azo, Mirex, Arsenic (As), Beryllium (Be), Bismuth (Bi), Selenium (Se), Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC), select Perfluorocarbons (PFC), select Chlorinated Fluorocarbons (CFC), select Halons, select HCFC, select HBFC" February 12, 2008 KA/2007/C2822R3 SGS
(PDF, 1993kB)
芯片粘接材料的ICP数据(English only)
- DIE ATTACH ABLESTIK Ablebond 2100A "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polychlorinated Terphenyls (PCT), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Polyvinyl chloride (PVC), Mirex, Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Tetrabromobiphenl-A bis (TBBP-A)" December 18, 2007 CE/2007/C3144 SGS
(PDF, 224kB)
- DIE ATTACH ABLESTIK (FOR AMKOR) Ablebond 2000, Ablebond 2025D, Ablebond 2100A, Ablebond 2300, Ablebond 2053S, Ablebond 3003, Ablebond 3230, Ablebond MC723, Ablebond 8290, Ablebond 8510AA SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Perfluorooctanoic acid (PFOA), Perfluorooctane sulfonates (PFOS) July 6, 2007 Not Applicable Not Applicable
(PDF, 38kB)
- DIE ATTACH ABLESTIK (FOR CIRTEK) Ablebond 2600AT, Ablebond 2600K, Ablebond 8175A, Ablebond 8352L, Ablebond 84-1LMI, Ablebond 84-1LMISR4, Ablebond 84-3, Ablebond 8900NC SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Halogen, Antimony (Sb), Phosphorus (P) April 16, 2008 Not Applicable Not Applicable
(PDF, 31kB)
- DIE ATTACH ABLESTIK (FOR UNISEM) ABLEBOND Types 2025DSI, 2600AT, 2815A, 8006NS, 8200C, 8200TI, 8290, 84-3J, 84-1LMIS, 84-1LMISR4, 84-1LMISNB, SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Beryllium Copper (BeCu), Triphenyl tin (TPT), Tributyl tin (TBT), select Phathalates, Chlorinated flame retardants, Antimonty (Sb) April 29, 2008 Not Applicable Not Applicable
(PDF, 39kB)
- DIE ATTACH HITACHI AMK-02 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polychlorinated Terphenyls (PCT), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO), select Azo, Beryllium (Be), Polyvinyl chloride (PVC), select Hydroflourocarbon (HFC), select Perfluorocarbon (PFC), Mirex, Tetrabromobiphenyl A Bis (TBBP-A bis), Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Phosphorus (P)" May 26, 2008 08-05-QAC ETC
(PDF, 2410kB)
- DIE ATTACH HITACHI EN-4900G* "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polychlorinated Terphenyls (PCT), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO), select Azo, Beryllium (Be), Polyvinyl chloride (PVC), select Hydroflourocarbon (HFC), select Perfluorocarbon (PFC), Mirex, Tetrabromobiphenyl A Bis (TBBP-A bis), Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I)" April 30, 2008 08-04-QAC-172A ETC
(PDF, 461kB)
IC绑定线材料的ICP数据(English only)
- BOND WIRE MITSUBISHI (FOR ASE) Au wire 4N MG series "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polychlorinated Terphenyls (PCT), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Polyvinyl chloride (PVC), Mirex, Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Tetrabromobiphenl-A bis (TBBP-A)" June 5, 2007 KA/2007/52207-A-01 SGS
(PDF, 725kB)
- BOND WIRE HERAEUS (FOR AMKOR, CIRTEK & OSE) GOLD (Au) BOND WIRE TYPES HA3, HA5, HA6, HA9, H10
"TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 22, 2008 LF-CTSQYA08_01753 SGS
(PDF, 55kB)
- BOND WIRE HEREAUS (FOR AMKOR) Au wire, multiple types "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated triphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), Azo, Mirex, Tetrabromobisphenol A (TBBP-A )" July 13, 2007 F690501/LF-CTSAYA0-1545 2 SGS
(PDF, 645kB)
- BOND WIRE MKE (FOR AMKOR) Au wire Type 4N
"TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polyvinyl Chloride (PVC), Tributyl Tin (TBT), Triphenyl Tin (TPT), Azo, Mirex, Tetrabromobisphenol A (TBBP-A ), Select Phathalates, Select HydroFluoroCarbons (HFC), Select PerFluoroCarbons (PFC), Beryllium (Be), Cesium (Ce), Thallium (Th), Uranium (U), Strontium (Sr)" January 15, 2008 CE/2008/11713A SGS
(PDF, 268kB)
IC模塑材料的ICP数据(English only)
- MOLD COMPOUND NITTO DENKO MP-150SG, GC-7450KS-2, BC-7450KM-2, MP-8000AN, MP-8000C, MP-8000CH4, MP-8000CH4-A2, GE-100L, GE-100LFCS, GE-100LFCS-V, GE-100RFC, GE-7470L-A, HC-100XG-BMF, HC-100XJAA, HC-100XJAA-V SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) January 30, 2008 Not Applicable Not Applicable
(PDF, 60kB)
- MOLD COMPOUND SUMITOMO EME-G760 Type L SUPPLIER DOCUMENT STATEMENT FOR NON USE/MAX CONTENT OF SUBSTANCES: Cadmium ( Cd), Lead (Pb) , Hexavalent Chromium (CrVI), Mercury ( Hg), Polybrominated Biphenyls (PBB), Polybrominated Diphenly Ether (PBDE), Polychlorinated Biphenyls (PCB), Polychlorinated Napthalanes (PCN), Short Chain Chlorinated Parafins (SCCP) , Mirex, Tetrabromobisphenol A Bis (TBBP-A), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO), Polyvinyl Chloride (PVC), Asbestos, Azo compounds, Formaldehyde, Antimony (Sb), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) May 26, 2008 KA/2008/51724 SGS
(PDF, 252kB)
- MOLD COMPOUND SUMITOMO (FOR UNISEM) EME-6300H, EME-6600A, EME-6710S type, EME-6730B-L, EME-6730BL, EME-6600HR, EME-7351 type, EME-7351LS, EME-7730LF, EME-G600, EME-G600C, EME-G600KA, EME-E670C, EME-G700M, EME-G700HT, EME-G770HCD SUPPLIER STATEMENT OF NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Tributyl tin (TBT), Triphenyl tin (TPT) April 24, 2008 Not Applicable Not Applicable
(PDF, 735kB)
- MOLD COMPOUND SUMITOMO (FOR UTL) EME-6210DS, EME-6600CS, EME-6710SJ, EME-7730LF, EME-G600 TYPE, EME-G605, EME-G605L, EME-G700HA, EME-G700L, EME-G770HCD SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluorooctanoic acid (PFOA) February 12, 2008 Not Applicable Not Applicable
(PDF, 632kB)
- MOLD COMPOUND NITTO DENKO GE-100 Series TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Phosphorous (P) November 16, 2007 CE/2007/B2303 SGS
NITTO DENKO GE-100 Series
"TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated
biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 19, 2007 LPCI/22172/07 SGS
(PDF, 143kB)
IC表面抛光材料的ICP数据(English only)
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