		ENGLISH • 简体中文 • 日本語 • 한국어

Dallas封装图

封装图	封装	引脚	外形尺寸
56-G4009-001B 0.300 SOIC 16,20,24 & 28 LD	AOIX	28	300
56-G6011-002A 17mm X 17mm, w/4 CSBGA (7mm X 7mm), 144 Balls, 1.27MM Pitch	BGA	144	669
56-G6001-001A 208 PBGA(23X23), 4 Layer	BGA	208	906
56-G6022-001A 9MM X 11MM, 24 Balls BGA, 2 Layer 1.27 MM Pitch	BGA	24	354
56-G6002-001C 256L PBGA (27X27), 2 Layer	BGA	256	1063
56-G6004-001D 256L PBGA(27X27), 4 Layer	BGA	256	1063
56-G6010-002A 27mm X 27mm, 256 Balls w/4 CSBGA 1.27mm Pitch	BGA	256	1063
56-G6003-001C 300L PBGA(27X27), 4 Layer	BGA	300	1063
56-G6007-001B 316L PBGA(27X27), 4 Layer	BGA	316	1063
56-G6023-001A 10.16MM X 11.43MM, 36 Balls BGA, 2 Layer 1.27 MM Pitch	BGA	36	450
56-G6012-002A 35mm X 35mm, w/8 CSBGA (10mm X 10mm), 388 Balls, 1.27MM Pitch	BGA	388	1378
56-G6030-001A 48L Wire Bond BGA, 15.30 x 11.80MM,1.27MM Pitch,3.66MM Thick	BGA	48	602
56-G0CAN-F30A iButton F3	CAN	2	68
56-G0CAN-F50A iButton F5	CAN	2	68
56-G0003-001A1 PowerCap .990 34 Pin PowerCap Module	CAP	2	960
56-G0003-001A1 PowerCap .990 34 Pin PowerCap Module	CAP	4	960
56-G4008-001A 40 LD CERDIP Dual In-Line	CDIP	40	600
56-G4017-001B 8 Pin CDIP	CDIP	8	300
56-G4007-001A 52 Lead CERQUAD W/Glass Lens	CQUAD	52	755
56-G4018-001A 68 Pin CERQUAD	CQUAD	68	950
56-G6008-001A 100L CHIP SCALE BGA	CSBGA	100	394
56-G6008-002A 100L CHIP SCALE BGA 4 Layer	CSBGA	100	394
56-G6024-001A 100 LEAD, CSBGA (11X11) 1.00 MM PITCH, 1.40 MM THICK, 2 LAYER	CSBGA	100	433
56-G6008-003A 144L CHIP SCALE BGA 4 Layer	CSBGA	144	394
56-G6016-001B 13MM x 13MM, 144 Balls, TECSBGA, 4 Layer 1.00 MM PITCH	CSBGA	144	512
56-G6005-001B 16L CHIP SCALE BGA (4X4) 1.0MM PITCH, 1.40MM THICK, 2 LAYER	CSBGA	16	157
56-G6035-001A DRAWING, 14MM X 14MM, 169 BALLS, CSBGA 2 LAYER 1.00MM Pitch	CSBGA	169	551
56-G6013-001A 25L Chip Scale BGA	CSBGA	25	197
56-G6017-001C 17MM x 17MM, 256 Balls, CSBGA, 4 Layer	CSBGA	256	669
56-G6021-001A 17MM x 17MM, 256 Balls, CSBGA, 2 LAYER 1.00MM PITCH	CSBGA	256	669
56-G6028-001B 17MM X 17MM, 256 Balls CSBGA, 4 Layer 1.00 MM Pitch	CSBGA	256	669
56-G6006-001A 49L CHIP SCALE BGA	CSBGA	49	276
56-G6009-001B 10MM X 10MM, 81Balls, LFBGA,2 Layer 1.00 MM Pitch	CSBGA	81	394
56-G7003-001C DS2761X Flip Chip Package, PKG Code: BF1223-2	FCHIP	12	97
56-G7012-001A DS1845X FLIP CHIP PACKAGE, 0.52 MM PITCH, PKG CODE- BF1422-1	FCHIP	14	85
56-G7013-001A DS1804X FLIP CHIP PACKAGE, 0.434MM PITCH, PKG CODE- BF1522-1	FCHIP	15	67
56-G7009-001A DS2401X1 CHIP SCALE PACKAGE, PACKAGE CODE: BF211-1	FCHIP	2	26
56-G7010-001A DS2502X1 CHIP SCALE PACKAGE, PACKAGE CODE: BF211-2	FCHIP	2	36
56-G7002-000B DS60 Flip Chip Package, PKG Code: BF311-1	FCHIP	3	22
56-G7004-000A DS2411X Flip Chip, PKG Code: BF411-1	FCHIP	4	27
56-G7015-002A DS9503 CHIP SCALE PACKAGE, PKG CODE- BF411-3	FCHIP	4	33
56-G7016-001B DS2430AX Flip Chip Pkg, 1.1mm Pitch Pkg Code BF422-1	FCHIP	4	70
56-G7022-001B DS2433X Flip Chip Pkg, 1.10mm Pitch Pkg Code BF623-3	FCHIP	6	102
56-G7017-001A DS2415X FLIP CHIP PACKAGE, PKG CODE- BF611-1	FCHIP	6	45
56-G7018-001A DS2417X FLIP CHIP PACKAGE, 0.44 MM PITCH, PKG CODE- BF611-1	FCHIP	6	45
56-G7019-001A DS2406X FLIP CHIP PACKAGE, PKG CODE- BF623-1	FCHIP	6	77
56-G7011-001A DS2432X FLIP CHIP PACKAGE, 8-BUMP, 0.70 MM PITCH, PKG CODE- BF823-1	FCHIP	8	73
56-G6019-001B 27MM x 27MM, 349 AND 400 Balls, 1.27 PITCH, 4 LAYER, HS-CSBGA	HCBGA	349	1063
56-G6038-002C DRAWING, 23MM X 23MM 484 Balls BGA w/ Heat Sink	HSBGA	484	906
56-G6029-002A 676 Lead, TEPBGA (27 X 27), 1.00MM Pitch, 2.28MM Thick, 4 Layer (WITH HEAT SINK)	HSBGA	676	1063
56-G5032-001B1 10 Lead LCCC (5.00MM X 3.20MM X 2.05MM)	LCCC	10	126
56-G5032-002A2 10 Lead LCCC (5.00MM X 3.20MM X 1.49MM)	LCCC	10	126
56-G6034-001A1 9 Lead LGA (14.00MM X 9.00MM)	LGA	9	354
56-G5002-000B 100 LD LQFP 14X14X1.4 MM BODY	LQFP	100	551
21-0086D PKG. OUTLINE, 128L LQFP, 14x20x1.4 mm	LQFP	128	787
56-G6037-001A DRAWING, 20MM X 20MM X 1.4MM, 144L LQFP	LQFP	144	787
56-G6037-002A DRAWING, 20MM X 20MM 144L LQFP	LQFP	144	787
56-G4021-001A 32/48L LQFP 7 x 7 x 1.4mm	LQFP	48	276
56-G4019-001A 64 ld LQFP 10 x 10 x 1.4 Body, 1.0/.10 Form	LQFP	64	394
56-G6003-001C 300L PBGA(27X27), 4 Layer	MCMBGA	300	1063
56-G0001-002A Encapsulated 14 Pin DIP Module	MOD	14	600
56-G0001-001A Encapsulated DIP Package	MOD	24	600
56-G0002-001A Encapsulated Modules and Clocks	MOD	24	600
56-G6031-001A 256 Lead PBGA (27X27) 1.27 MM Pitch, 8.20 MM Thick, 2 Layer	MOD	256	1063
56-G0001-001A Encapsulated DIP Package	MOD	28	600
56-G0002-001A Encapsulated Modules and Clocks	MOD	28	600
56-G0002-001A Encapsulated Modules and Clocks	MOD	32	600
56-G0002-001A Encapsulated Modules and Clocks	MOD	36	600
56-G0001-001A Encapsulated DIP Package	MOD	40	600
56-G0002-001A Encapsulated Modules and Clocks	MOD	40	600
56-G4005-002B 100 Lead MQFP 14X20 BODY, 1.95 Form	MQFP	100	787
56-G3001-001B 44 Lead MQFP 10X10X2 Body	MQFP	44	394
56-G4005-001C 80 Lead MQFP 14X20 Body, 1.95 Form	MQFP	80	787
56-G6003-002B 400L PBGA(27X27), 4 Layer	PBGA	400	1063
56-G5005-001A 14 Lead Plastic Dual-In-Line Package .300"	PDIP	10	300
56-G5005-001A 14 Lead Plastic Dual-In-Line Package .300"	PDIP	14	300
56-G5005-002A 16 Lead Plastic Dual-In-Line Package .300"	PDIP	16	300
56-G5005-003A 18 Lead Plastic Dual-In-Line Package .300"	PDIP	18	300
56-G5005-004A 20 Lead Plastic Dual-In-Line Package .300"	PDIP	20	300
56-G5005-001A 14 Lead Plastic Dual-In-Line Package .300"	PDIP	24	300
56-G5000-003A 24 LEAD Plastic Dual-In-Line Package .600"	PDIP	24	600
56-G5000-002A 28 LEAD Plastic Dual-In-Line Package .600"	PDIP	28	600
56-G5000-001A 32 LD Plastic Dual-In-Line	PDIP	32	600
56-G5000-000A 40 LD Plastic Dual-In-Line	PDIP	40	600
56-G5005-000A 8 Lead Plastic Dual-In-Line Package .300"	PDIP	8	300
56-G4001-001A1 28 Pin PLCC, Square	PLCC	28	452
56-G4002-001A1 32 Pin PLCC, Rectangular	PLCC	32	500
56-G4003-001B1 44 Pin PLCC, Square	PLCC	44	652
56-G4006-001B1 52 Lead PLCC, Square	PLCC	52	752
56-G5001-000A1 68 Lead PLCC SQ.	PLCC	68	952
56-G0004-001C PR35 (Extended TO-92)	PR35	3	185
56-G0003-001A1 PowerCap .990 34 Pin PowerCap Module	PWRCP	34	960
21-0103D PKG. OUTLINE, CUSTOM, 68L QFN, 10x10x0.90 mm	QFN	68	394
21-0055G PACKAGE OUTLINE, QSOP .150", .025" LEAD PITCH	QSOP	13	150
21-0055G PACKAGE OUTLINE, QSOP .150", .025" LEAD PITCH	QSOP	16	150
21-0055G PACKAGE OUTLINE, QSOP .150", .025" LEAD PITCH	QSOP	20	150
21-0055G PACKAGE OUTLINE, QSOP .150", .025" LEAD PITCH	QSOP	24	150
21-0047B PACKAGE FAMILY OUTLINE, SIDE BRAZE .300"	SBRC	14	300
56-00SFN-000B 6 X 6mm SFN	SFN	2	236
56-G2008-001C .150 SOIC 8, 14, & 16 Lead	SOIC	14	150
56-G2008-001C .150 SOIC 8, 14, & 16 Lead	SOIC	16	150
56-G4009-001B 0.300 SOIC 16,20,24 & 28 LD	SOIC	16	300
21-0042B PACKAGE OUTLINE, .300" SOIC	SOIC	18	300
56-G4009-001B 0.300 SOIC 16,20,24 & 28 LD	SOIC	20	300
56-G4009-001B 0.300 SOIC 16,20,24 & 28 LD	SOIC	24	300
56-G4009-001B 0.300 SOIC 16,20,24 & 28 LD	SOIC	28	300
56-G2009-028A 28 Lead SOIC, .330	SOIC	28	330
56-G2008-001C .150 SOIC 8, 14, & 16 Lead	SOIC	8	150
56-G4010-001B .208" 8 Lead SOIC	SOIC	8	208
21-0051H PACKAGE OUTLINE, 3L SOT-23	SOT-23	3	50
21-0057F PACKAGE OUTLINE, SOT-23, 5L	SOT-23	5	65
21-0051H PACKAGE OUTLINE, 3L SOT-23	SOT23	3	50
21-0057F PACKAGE OUTLINE, SOT-23, 5L	SOT23	5	65
21-0058I PACKAGE OUTLINE, SOT 6L BODY	SOT23	6	64
21-0078H PKG. OUTLINE, SOT23, 8L	SOT23	8	60
21-0056C PACKAGE OUTLINE, SSOP, 5.3x.65mm	SSOP	16	209
21-0056C PACKAGE OUTLINE, SSOP, 5.3x.65mm	SSOP	24	209
21-0056C PACKAGE OUTLINE, SSOP, 5.3x.65mm	SSOP	28	209
21-0056C PACKAGE OUTLINE, SSOP, 5.3x.65mm	SSOP	36	300
56-G0005-001A SOT-223 (TO-261)	ST223	3	137
56-G7007-001B 0.50MM Grid 3x3 Ball Array Used on Ds2431, PKG Code: BR622-1	T2 CSP RDL	6	66
56-G6008-002A 100L CHIP SCALE BGA 4 Layer	TCBGA	100	394
56-G6016-001B 13MM x 13MM, 144 Balls, TECSBGA, 4 Layer 1.00 MM PITCH	TCBGA	144	512
21-0137I PKG. OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.8 mm	TDFN	10	118
56-G0012-001A 10 LEAD TDFN 3.0MM X 4.0MM, 0.5MM PITCH	TDFN	10	118
21-0137I PKG. OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.8 mm	TDFN	14	118
56-G0010-001A 14 LEAD TDFN 3.0MM X 5.0MM, 0.4MM PITCH	TDFN	14	118
56-G0011-001A 28 LEAD TDFN 8.0MM X 4.0MM, 0.5MM PITCH	TDFN	28	157
21-0137I PKG. OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.8 mm	TDFN	6	118
21-0137I PKG. OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.8 mm	TDFN	8	118
21-0174B PKG. OUTLINE, 8L, TDFN, EXPOSED PAD, 2x3x0.8 mm	TDFN	8	80
56-G6020-001A 17MM x 17MM, 144 Balls, TE-PBGA, 4 Layer 1.27 MM Pitch	TEBGA	144	669
56-G6003-002B 400L PBGA(27X27), 4 Layer	TEBGA	400	1063
56-G6003-003A 400L PBGA(27X27), 4 Layer	TEBGA	400	1063
56-G6038-001B DRAWING, 23MM X 23MM 484 Balls BGA	TEBGA	484	906
56-G6029-001A 676 Lead, TEPBGA (27 X 27), 1.00MM Pitch, 2.28MM Thick, 4 Layer	TEBGA	676	1063
56-G6020-001A 17MM x 17MM, 144 Balls, TE-PBGA, 4 Layer 1.27 MM Pitch	TEBGAQ	144	669
56-P4008-001A 3 Lead D2PAK TO-220 Tabless	TO220	3	400
56-G0006-002A TO-92, 2-PIN	TO92	2	185
56-G0006-001A TO-92 3-PIN	TO92	3	185
56-G0006-003A TO-92, 3-PIN JFORMED LEADS	TO92	3	185
21-0139H PKG. OUTLINE, 12,16,20,24,28L THIN QFN, 4x4x0.8 mm	TQFN	12	157
21-0136I PKG. OUTLINE, 8, 12,16L THIN QFN, 3x3x0.8 mm	TQFN	16	118
21-0139H PKG. OUTLINE, 12,16,20,24,28L THIN QFN, 4x4x0.8 mm	TQFN	16	157
21-0140L PKG. OUTLINE, 16,20,28,32,40L THIN QFN, 5x5x0.8 mm	TQFN	16	197
21-0140L PKG. OUTLINE, 16,20,28,32,40L THIN QFN, 5x5x0.8 mm	TQFN	20	197
21-0139H PKG. OUTLINE, 12,16,20,24,28L THIN QFN, 4x4x0.8 mm	TQFN	24	157
21-0139H PKG. OUTLINE, 12,16,20,24,28L THIN QFN, 4x4x0.8 mm	TQFN	28	157
21-0140L PKG. OUTLINE, 16,20,28,32,40L THIN QFN, 5x5x0.8 mm	TQFN	28	197
21-0140L PKG. OUTLINE, 16,20,28,32,40L THIN QFN, 5x5x0.8 mm	TQFN	32	197
21-0144F PKG. OUTLINE, 32,44,48,56L THIN QFN, 7x7x0.8 mm	TQFN	32	275
21-0141I PKG. OUTLINE, 36,40,48L THIN QFN, 6x6x0.8 mm	TQFN	36	236
21-0172B PKG. OUTLINE, 38L THIN QFN, 5x7x0.8 mm	TQFN	38	197
21-0144F PKG. OUTLINE, 32,44,48,56L THIN QFN, 7x7x0.8 mm	TQFN	48	275
21-0187A PKG. OUTLINE, 56L THIN QFN, 5x11x0.8 mm	TQFN	56	197
21-0135F PKG. OUTLINE, 56L THIN QFN, 8x8x0.8 mm	TQFN	56	315
21-0142E PKG. OUTLINE, 68L THIN QFN, 10x10x0.8 mm	TQFN	68	394
21-0136I PKG. OUTLINE, 8, 12,16L THIN QFN, 3x3x0.8 mm	TQFN	8	118
21-0087C PKG. OUTLINE, 144L, 20x20x1.0 mm TQFP	TQFP	144	787
56-G4004-001A 32 Lead TQFP 7x7x1 MM Body	TQFP	32	276
56-G4012-001B 44 LD, TQFP 10 X 10X 1.MM	TQFP	44	394
56-G4016-001A 48 Lead TQFP 7 X7 1MM Body	TQFP	48	276
56-G4014-001C 52 Lead TQFP 10X10X1 Body, 1.0/0.1 FORM	TQFP	52	394
56-G4013-001A 64 LD TQFP 10X10X1	TQFP	64	394
56-G2016-001C1 6 Lead TSOC	TSOC	6	150
56-G5003-000B 28 Lead TSOP(1) 8 X 13.4MM	TSOP	28	528
56-G5003-001A 32 Lead TSOP(1) 8 X 20MM	TSOP	32	787
56-G2017-003A Thin SOT 23, 5 Lead	TSOT	5	50
21-0114C PACKAGE OUTLINE, 6L THIN SOT23, (1.00mm LOW PROFILE)	TSOT	6	63
56-G2015-000B 14 Lead TSSOP 4.4 MM Body	TSSOP	14	173
56-G2019-000A 16 Lead TSSOP, 4.4 MM Body	TSSOP	16	173
21-0108F PKG. OUTLINE, TSSOP, 4.4 mm BODY, EXPOSED PAD	TSSOP	20	173
56-G2010-000B 20 Lead TSSOP 4.4 MM Body	TSSOP	20	173
56-G2014-001A 24 Lead TSSOP 4.4 MM Body	TSSOP	24	173
21-0108F PKG. OUTLINE, TSSOP, 4.4 mm BODY, EXPOSED PAD	TSSOP	28	173
56-G2020-001A 28 Lead, TSSOP, 4.4MM Body	TSSOP	28	173
56-G2021-000A 8LD TSSOP, 4.4MM BODY	TSSOP	8	173
21-0104F PKG. OUTLINE, 4x3 UCSP	UCSP	12	61
21-0104F PKG. OUTLINE, 4x3 UCSP	UCSP	12	65
21-0101H PKG. OUTLINE, 4x4 UCSP	UCSP	16	80
21-0095J PKG. OUTLINE, 5x4 UCSP	UCSP	20	80
21-0127D PKG. OUTLINE, 5x4 UCSP, (WC11Z)	UCSP	20	80
21-0095J PKG. OUTLINE, 5x4 UCSP	UCSP	20	85
21-0096H PKG. OUTLINE, 5x5 UCSP	UCSP	25	100
21-0123G PKG. OUTLINE, 6x5 UCSP	UCSP	30	100
21-0082K PKG. OUTLINE, 6x6 UCSP	UCSP	36	120
21-0117G PKG. OUTLINE, 2x2 UCSP	UCSP	4	38
21-0117G PKG. OUTLINE, 2x2 UCSP	UCSP	4	39
21-0117G PKG. OUTLINE, 2x2 UCSP	UCSP	4	41
21-0117G PKG. OUTLINE, 2x2 UCSP	UCSP	4	43
21-0097G PKG. OUTLINE, 3x2 UCSP	UCSP	6	38
21-0097G PKG. OUTLINE, 3x2 UCSP	UCSP	6	39
21-0097G PKG. OUTLINE, 3x2 UCSP	UCSP	6	41
21-0097G PKG. OUTLINE, 3x2 UCSP	UCSP	6	46
21-0156A PKG. OUTLINE, 4x2 UCSP	UCSP	8	40
21-0093L PKG. OUTLINE, 3x3 UCSP	UCSP	9	60
21-0093L PKG. OUTLINE, 3x3 UCSP	UCSP	9	63
21-0093L PKG. OUTLINE, 3x3 UCSP	UCSP	9	69
56-G7007-001B 0.50MM Grid 3x3 Ball Array Used on Ds2431, PKG Code: BR622-1	UCSPR	6	66
56-G7006-002B WLCSP 0.50MM Ball Grid 4 X 3 Variation 002, PKG Code: BR823-1	UCSPR	8	73
21-0164B PACKAGE OUTLINE, 6,8,10L uDFN, 2.0x2.0x0.8mm	UDFN	10	79
21-0147E PACKAGE OUTLINE, 6L uDFN, 1.5x1.0x0.8mm	UDFN	6	59
21-0164B PACKAGE OUTLINE, 6,8,10L uDFN, 2.0x2.0x0.8mm	UDFN	6	79
21-0164B PACKAGE OUTLINE, 6,8,10L uDFN, 2.0x2.0x0.8mm	UDFN	8	79
21-0061J PACKAGE OUTLINE, 10L uMAX/uSOP	uSOP	10	118
21-0036J PACKAGE OUTLINE, 8L uMAX/uSOP	uSOP	8	118
21-0107C PKG. OUTLINE, 8L uMAX/uSOP, EXPOSED PAD	uSOP	8	118
21-0200B PACKAGE OUTLINE, 16L WLP PKG, 0.5mm PITCH	WLP	16	83
21-0195A PACKAGE OUTLINE, 45L WAFER LEVEL PKG, 2.52x2.67mm	WLP	45	99
21-0196D PACKAGE OUTLINE, 46L WLP	WLP	46	129
21-0193B PACKAGE OUTLINE, 60L WLP PKG. (WD22)	WLP	57	136
21-0173A WAFER LEVEL PKG. (MAX 2160)	WLP	81	125


© 2008 Maxim Integrated Products, Dallas Semiconductor版权所有 • 法律声明 • 隐私权政策